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      KCI등재 SCIE

      Research on the Critical Condition of Brittle-Ductile Transition about Micro-Milling of KDP Crystal and Experimental Verification

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      https://www.riss.kr/link?id=A104358701

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      다국어 초록 (Multilingual Abstract)

      KDP crystal is a kind of brittle material, and improper selection of processing parameter can easily result in brittle domain cuttingof KDP crystal. Determining the critical cutting depth of micro-milling brittle-ductile transition of KDP crystal can guide the selectionof process parameters. The elastic-plastic contact formula of blunt spherical indenter and brittle materials is used to explicate thecontact of micro-cutter edge and brittle materials. Combined with indentation critical load equation, the calculation model ofpredicting the critical cutting depth is established. The critical cutting depth is the function of material properties of the workpiece,the tool material properties and the tool edge radius. The edge radius of CBN flat end milling cutter is measured by atomic forcemicroscopy, and then the critical cutting depth of the KDP crystal material is calculated as 230 nm. By using this milling cutter, microgroovemilling experiments are conducted with different spindle speeds and feeds. The results demonstrate that as the spindle speedincreases, the micro-groove bottom surface gradually transformed from the brittle cutting state to plastic cutting state. The criticalspindle speed is 30000 rpm, and the maximum deformed cutting thickness is 227 nm, which coincides with the result of the theoreticalcalculation model.
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      KDP crystal is a kind of brittle material, and improper selection of processing parameter can easily result in brittle domain cuttingof KDP crystal. Determining the critical cutting depth of micro-milling brittle-ductile transition of KDP crystal can ...

      KDP crystal is a kind of brittle material, and improper selection of processing parameter can easily result in brittle domain cuttingof KDP crystal. Determining the critical cutting depth of micro-milling brittle-ductile transition of KDP crystal can guide the selectionof process parameters. The elastic-plastic contact formula of blunt spherical indenter and brittle materials is used to explicate thecontact of micro-cutter edge and brittle materials. Combined with indentation critical load equation, the calculation model ofpredicting the critical cutting depth is established. The critical cutting depth is the function of material properties of the workpiece,the tool material properties and the tool edge radius. The edge radius of CBN flat end milling cutter is measured by atomic forcemicroscopy, and then the critical cutting depth of the KDP crystal material is calculated as 230 nm. By using this milling cutter, microgroovemilling experiments are conducted with different spindle speeds and feeds. The results demonstrate that as the spindle speedincreases, the micro-groove bottom surface gradually transformed from the brittle cutting state to plastic cutting state. The criticalspindle speed is 30000 rpm, and the maximum deformed cutting thickness is 227 nm, which coincides with the result of the theoreticalcalculation model.

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      참고문헌 (Reference)

      1 Wang, J., "Survey and Summary from DNA Biosensors to Gene Chips" 28 (28): 3011-3016, 2000

      2 Xiao, Y., "Research on Accuracy Analysis and Performance Verification Test of Micro-Precise Five-Axis Machine Tool" 67 (67): 387-395, 2013

      3 Heath, P. J., "Properties and Uses of Amborite [Polycrystalline cBN]" 46 (46): 120-127, 1986

      4 Guillet, F., "Preliminary Results on Mitigation of Kdp Surface Damage using the Ball Dimpling Method" 6720 : 672008-, 2007

      5 Suzuki, H., "Precision Cutting of Aspherical Ceramic Molds with Micro PCD Milling Tool" 56 (56): 131-134, 2007

      6 Mohan Reddy Moola, "Optimization of Various Cutting Parameters on the Surface Roughness of the Machinable Glass Ceramic with Two Flute Square End Mills of Micro Grain Solid Carbide" 한국정밀공학회 13 (13): 1549-1554, 2012

      7 Zhang, Q., "Nano-Indentation of Cubic and Tetragonal Single Crystals" University of Rochester 2008

      8 고태조, "Mill-Grinding with Electroplated Diamond Abrasives for Ceramic Cutting" 한국정밀공학회 13 (13): 5-10, 2012

      9 Fang, T., "Microhardness and Indentation Fracture of Potassium Dihydrogen Phosphate (KDP)" 85 (85): 174-178, 2002

      10 Hrubesh, L. W., "Methods for Mitigating Growth of Laser-Initiated Surface Damage on DKDP Optics at 351 nm" 4932 : 180-191, 2003

      1 Wang, J., "Survey and Summary from DNA Biosensors to Gene Chips" 28 (28): 3011-3016, 2000

      2 Xiao, Y., "Research on Accuracy Analysis and Performance Verification Test of Micro-Precise Five-Axis Machine Tool" 67 (67): 387-395, 2013

      3 Heath, P. J., "Properties and Uses of Amborite [Polycrystalline cBN]" 46 (46): 120-127, 1986

      4 Guillet, F., "Preliminary Results on Mitigation of Kdp Surface Damage using the Ball Dimpling Method" 6720 : 672008-, 2007

      5 Suzuki, H., "Precision Cutting of Aspherical Ceramic Molds with Micro PCD Milling Tool" 56 (56): 131-134, 2007

      6 Mohan Reddy Moola, "Optimization of Various Cutting Parameters on the Surface Roughness of the Machinable Glass Ceramic with Two Flute Square End Mills of Micro Grain Solid Carbide" 한국정밀공학회 13 (13): 1549-1554, 2012

      7 Zhang, Q., "Nano-Indentation of Cubic and Tetragonal Single Crystals" University of Rochester 2008

      8 고태조, "Mill-Grinding with Electroplated Diamond Abrasives for Ceramic Cutting" 한국정밀공학회 13 (13): 5-10, 2012

      9 Fang, T., "Microhardness and Indentation Fracture of Potassium Dihydrogen Phosphate (KDP)" 85 (85): 174-178, 2002

      10 Hrubesh, L. W., "Methods for Mitigating Growth of Laser-Initiated Surface Damage on DKDP Optics at 351 nm" 4932 : 180-191, 2003

      11 Demos, S. G., "Mechanisms to Explain Damage Growth in Optical Materials" 4347 : 2000

      12 Zhang, K. C., "Material Science of Nonlinear Optical Crystals" Science Press 86-102, 1996

      13 Ono, T., "Influence of Tool Inclination on Brittle Fracture in Glass Cutting with Ball End Mills" 202 (202): 61-69, 2008

      14 Lawn, B., "Indentation Fracture: Principles and Applications" 10 (10): 1049-1081, 1975

      15 Lawn, B. R., "Hardness, Toughness, and Brittleness: An Indentation Analysis" 62 (62): 347-350, 1979

      16 Norton, M. A., "Growth of Laser Initiated Damage in Fused Silica at 351nm" 4347 : 2001

      17 Lawn, B. R., "Fracture of Brittle Solids" Cambridge University Press 251-257, 1975

      18 Matsumura, T., "Effect of Tool Inclination on Machining of Tungsten Carbide with a CBN Ball End Mill" 95-102, 2006

      19 Foy, K., "Effect of Tilt Angle on Cutting Regime Transition in Glass Micromilling" 49 (49): 315-324, 2009

      20 Bifano, T. G., "Ductile-Regime Grinding: A New Technology for Machining Brittle Materials" 113 (113): 184-189, 1991

      21 Blake, P. N., "Ductile - Regime Machining of Germanium and Silicon" 73 (73): 949-957, 1990

      22 De Yoreo, J. J., "Developing KH2PO4 and KD2PO4 Crystals for the World's Most Power Laser" 47 (47): 113-152, 2002

      23 Negres, R. A., "Decomposition of KH2PO4 Crystals during Laser-Induced Breakdown" 86 (86): 171107-, 2005

      24 Matsumura, T., "Cutting Process of Glass with Inclined Ball End mill" 200 (200): 356-363, 2008

      25 Arif, M., "Analytical Modeling of Ductile-Regime Machining of Tungsten Carbide by Endmilling" 55 (55): 53-64, 2011

      26 Arif, M., "An Experimental Approach to Study the Capability of End-Milling for Microcutting of Glass" 53 (53): 1063-1073, 2011

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      2023 평가예정 해외DB학술지평가 신청대상 (해외등재 학술지 평가)
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      2005-05-30 학술지명변경 한글명 : International Journal of the Korean of Precision Engineering -> International Journal of Precision Engineering and Manufacturing
      외국어명 : International Journal of the Korean of Precision Engineering -> International Journal of Precision Engineering and Manufacturing
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