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      KCI등재 SCIE SCOPUS

      Liquid Cooling of Laser-driven Head Light Employing Heat Spreader Manufactured by 3D Metal Printing

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      https://www.riss.kr/link?id=A105257183

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      다국어 초록 (Multilingual Abstract) kakao i 다국어 번역

      Laser-driven white lighting is attracting attention due to its advantages compared to LED-based white lighting systems, such as high luminous intensity, high efficacy, and the possibility of miniaturization. The optical efficiency of a lighting system based on high-power laser diodes (LDs) is highly affected by the temperature of the LD and phosphor, meaning cooling is critical for many practical applications. The junction temperature must be properly predicted and controlled to prevent failure of the LD. This paper presents a thermal dynamic model of an LD cooling system for predicting the junction temperature and an experiment to validate the model. The system consists of an LD, heat spreader, heat sink, and liquid pump. The system was placed inside a test chamber, and the temperature of each element was measured under various ambient temperatures. The results were then compared with the simulation results. A heat spreader was designed with liquid cooling channels based on the model in consideration of both the thermal resistance and pressure drop. The spreader was then fabricated using 3D metal printing. The spreader provided higher performance compared with thermoelectric cooling.
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      Laser-driven white lighting is attracting attention due to its advantages compared to LED-based white lighting systems, such as high luminous intensity, high efficacy, and the possibility of miniaturization. The optical efficiency of a lighting system...

      Laser-driven white lighting is attracting attention due to its advantages compared to LED-based white lighting systems, such as high luminous intensity, high efficacy, and the possibility of miniaturization. The optical efficiency of a lighting system based on high-power laser diodes (LDs) is highly affected by the temperature of the LD and phosphor, meaning cooling is critical for many practical applications. The junction temperature must be properly predicted and controlled to prevent failure of the LD. This paper presents a thermal dynamic model of an LD cooling system for predicting the junction temperature and an experiment to validate the model. The system consists of an LD, heat spreader, heat sink, and liquid pump. The system was placed inside a test chamber, and the temperature of each element was measured under various ambient temperatures. The results were then compared with the simulation results. A heat spreader was designed with liquid cooling channels based on the model in consideration of both the thermal resistance and pressure drop. The spreader was then fabricated using 3D metal printing. The spreader provided higher performance compared with thermoelectric cooling.

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      참고문헌 (Reference)

      1 Ulrich, L., "Whiter Brights with Lasers" 50 (50): 36-56, 2013

      2 Chein, R., "Thermoelectric Cooler Application in Electronic Cooling" 24 (24): 2207-2217, 2004

      3 Wang, J., "Thermal Design and Simulation of Automotive Headlamps Using White LEDs" 45 (45): 249-255, 2014

      4 Beach, R., "Modular Microchannel Cooled Heatsinks for High Average Power Laser Diode Arrays" 28 (28): 966-976, 1992

      5 Lee, D., "Modeling of Reflection-Type Laser-Driven White Lighting Considering Phosphor Particles and Surface Topography" 23 (23): 18872-18887, 2015

      6 Garcia, J., "Modeling and Simulating the Dynamic Electrothermal Behavior of Power Electronic Circuits Using Bond Graphs" 2 : 1641-1647, 1996

      7 Feenstra, P. J., "Modeling and Instrumentation for Fault Detection and Isolation of a Cooling System" 365-372, 2000

      8 Missaggia, L. J., "Microchannel Heat Sinks for Two-Dimensional High-Power-Density Diode Laser Arrays" 25 (25): 1988-1992, 1989

      9 Lorenzen, D., "Micro Thermal Management of High-Power Diode Laser Bars" 48 (48): 286-297, 2001

      10 Shah, R. K., "Laminar Flow Forced Convection Heat Transfer and flow Friction in Straight and Curved Ducts- a Summary of Analytical Solutions" Stanford University 1971

      1 Ulrich, L., "Whiter Brights with Lasers" 50 (50): 36-56, 2013

      2 Chein, R., "Thermoelectric Cooler Application in Electronic Cooling" 24 (24): 2207-2217, 2004

      3 Wang, J., "Thermal Design and Simulation of Automotive Headlamps Using White LEDs" 45 (45): 249-255, 2014

      4 Beach, R., "Modular Microchannel Cooled Heatsinks for High Average Power Laser Diode Arrays" 28 (28): 966-976, 1992

      5 Lee, D., "Modeling of Reflection-Type Laser-Driven White Lighting Considering Phosphor Particles and Surface Topography" 23 (23): 18872-18887, 2015

      6 Garcia, J., "Modeling and Simulating the Dynamic Electrothermal Behavior of Power Electronic Circuits Using Bond Graphs" 2 : 1641-1647, 1996

      7 Feenstra, P. J., "Modeling and Instrumentation for Fault Detection and Isolation of a Cooling System" 365-372, 2000

      8 Missaggia, L. J., "Microchannel Heat Sinks for Two-Dimensional High-Power-Density Diode Laser Arrays" 25 (25): 1988-1992, 1989

      9 Lorenzen, D., "Micro Thermal Management of High-Power Diode Laser Bars" 48 (48): 286-297, 2001

      10 Shah, R. K., "Laminar Flow Forced Convection Heat Transfer and flow Friction in Straight and Curved Ducts- a Summary of Analytical Solutions" Stanford University 1971

      11 Huang, M., "Heat Generation by the Phosphor Layer of High-Power White LED Emitters" 25 (25): 1317-1320, 2013

      12 Kim, J.-K., "Estimation of Thermal Parameters of the Enclosed Electronic Package System by Using Dynamic Thermal Response" 19 (19): 1034-1040, 2009

      13 Garcia, J., "Electrothermal Bond Graph Model for Semiconductor Switching Devices" 1 : 258-263, 1996

      14 Pahor, S., "Die Nusseltsche Zahl fur Laminare Stromung im Zylindrischen Rohr Mit Konstanter Wandtemperatur" 7 : 536-538, 1956

      15 Vermeersch, B., "Dependency of Thermal Spreading Resistance on Convective Heat Transfer Coefficient" 48 (48): 734-738, 2008

      16 Kim, J. K., "Compact Thermal Network Model of the Thermal Interface Material Measurement Apparatus with Multi-Dimensional Heat Flow" 1 (1): 1186-1194, 2011

      17 Karnopp, D., "Bond Graph Models for Electrochemical Energy Storage: Electrical, Chemical and Thermal Effects" 327 (327): 983-992, 1990

      18 Feenstra, P. J., "Bond Graph Modeling Procedures for Fault Detection and Isolation of Complex Flow Processes" 77-82, 2001

      19 "Bond Graph"

      20 Katou, Y., "Advanced Heat Transfer" Yougentou Press 1984

      21 Zhao, D., "A Review of Thermoelectric Cooling: Materials, Modeling and Applications" 66 (66): 15-24, 2014

      22 Naphon, P., "A Review of Flow and Heat Transfer Characteristics in Curved Tubes" 10 (10): 463-490, 2006

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      학술지 이력

      학술지 이력
      연월일 이력구분 이력상세 등재구분
      2023 평가예정 해외DB학술지평가 신청대상 (해외등재 학술지 평가)
      2020-01-01 평가 등재학술지 유지 (해외등재 학술지 평가) KCI등재
      2015-04-01 평가 SCIE 등재 (기타) KCI등재
      2008-06-23 학회명변경 영문명 : Korean Society Of Precision Engineering -> Korean Society for Precision Engineering
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      기준연도 WOS-KCI 통합IF(2년) KCIF(2년) KCIF(3년)
      2016 3.62 2.24 0
      KCIF(4년) KCIF(5년) 중심성지수(3년) 즉시성지수
      0 0 0 0.21
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