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RISS 인기검색어
- 검색키워드
- 저자 : Yüzüak E. (검색결과 3 건)
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Thickness induced magnetic anisotropic properties of Tb-Fe-Co thin films
Yüzüak G. Durak,Yüzüak E.,Ennen I.,Hütten A. 한국물리학회 2021 Current Applied Physics Vol.29 No.-
The influence of Tb25Fe61Co14 thin film thicknesses varying from 2 to 300 nm on the structural and magnetic properties has been systematically investigated by using of X-ray diffraction, scanning electron microscopy, transmission electron microscopy, magnetization, and magneto-optic Kerr effect microscopy measurements. Thin film growth mechanism is pursued and controlled by ex-situ X-ray refractometry measurements. X-ray diffraction studies reveal that the Tb25Fe61Co14 films are amorphous regardless of thin films thicknesses. The magnetic properties are found to be strongly related to thickness and preferred orientation. With an increase in film thickness, the easy axis of magnetization is reversed from in-plane to out-of-plane direction. The change in the easy axes direction also affects the remanence, coercivity and magnetic anisotropy values. The cause for the magnetic anisotropy direction change from in-plane to out-of-plane can be related to the preferred orientation of the thin film which depends on the large out-of-plane coercivity and plays an important role in deciding the easy axes direction of the films. According to our results, up to the 100 nm in-plane direction is dominated over the whole system under major Fe-Fe interaction region, after that point, the magnetic anisotropy direction change to the out-of-plane under major Tb-Fe/Tb-Co interaction region and preferred orientation dependent perpendicular magnetic anisotropic properties become more dominated with 2.7 kOe high coercive field values.
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Magneto‑Impedance in Co35Fe65/Cu/Co35Fe65 Single and Bi‑layer Thin Films
G. Durak Yüzüak,E. Yüzüak,V. Nevruzoğlu 대한금속·재료학회 2020 ELECTRONIC MATERIALS LETTERS Vol.16 No.5
The magneto-impedance response in Co35Fe65/Cu/Co35Fe65 thin film magneto-impedance cells deposited by the thermalevaporation method has been studied with single and bilayer structures at the substrate temperature 300 K and 150 K. Whilethe thin film deposited at 300 K has BCC structure, the amorphous character is dominant for 150 K deposited ones. Entirefilms show soft magnetic behavior with high saturation magnetization (MS) and low coercive field (HC). Bilayer thin filmstructure reveals higher magneto-impedance values than single-layer thin films. The relation between the magneto-impedanceeffect and layered structure is discussed in terms of structural growing mechanism and scattering effect. The highest magnetoimpedancesensitivity (η) 37%/Oe is observed for the Co35Fe65/Cu/Co35Fe65 bilayer thin film. The HCand remanence ratio(MR/MS) values for single layer at 300 K, single and bilayer cells at 150 K are measured as 51, 158 and 253 Oe—0.48, 0.78,and 0.80, respectively. When η with the Soliton wave model is compared with the sample at room temperature, an increaseof over 1700% is observed. The difference between the classical growing method at 300 K and the Soliton wave model at150 K is the evidence of the logic of the work performed and its accuracy. The relatively high sensitivity is connected withinterlayer usage and low temperature-smaller particle size in Soliton model growth. The observed findings are of practicalimportance to develop future technological magnetic sensor applications with high sensitivity.
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Determination of Interfacial Energies for Solid Al Solution in Equilibrium with Al-Cu-Ag Liquid
K. Ke lio lu,Y. Ocak,S. Aksöz,N. Mara ll,E. Çadlrll,H. Kaya 대한금속·재료학회 2010 METALS AND MATERIALS International Vol.16 No.1
The equilibrated grain boundary groove shapes of a solid Al solution in equilibrium with Al-Cu-Ag liquid were observed from a quenched sample using a radial heat flow apparatus. The Gibbs-Thomson coefficient,solid-liquid interfacial energy, and grain boundary energy of the solid Al solution were determined from the observed grain boundary groove shapes. The thermal conductivity of the solid phase for Al-16.42 at.% Ag-4.97at.% Cu and Al-16.57 at.% Ag-11.87 at.% Cu alloys and the thermal conductivity ratio of the liquid phase to the solid phase for Al-16.57 at.% Ag-11.87 at.% Cu alloy at the melting temperature were also measured with a radial heat flow apparatus and a Bridgman-type growth apparatus, respectively.
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