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X ray CT Inspection Algorithm to Correct Missing Data
Toshiyuki Kaneko,Toshiyuki Tanaka,Kazuo Kikuchi 제어로봇시스템학회 2009 제어로봇시스템학회 국제학술대회 논문집 Vol.2009 No.8
X ray CT is for nondestructive inspection in industrial field. In X ray CY inspection, the problem is called “metal artifact” on the reconstructed image is one of the biggest issue. This study aims to reduce metal artifact. Metal artifact is caused primarily by missing projection data from every projection angle. So ,we propose the algorithm for correcting the missing projection data and confirm availability for nondestructive inspection in industrial field.
Preliminary Analysis of Interconnect Full Open Faults using TEG chips
Toshiyuki Tsutsumi,Yasuyuki Kariya,Masaki Hashizume,Hiroyuki Yotsuyanagi,Koji Yamazaki,Yoshinobu Higami,Hiroshi Takahashi,Yuzo Takamatsu 대한전자공학회 2009 ITC-CSCC :International Technical Conference on Ci Vol.2009 No.7
As LSIs are scale-down, there is an increasing need to take measures against open faults. However, no practical model for open faults exists at present. Therefore, we fabricated Test Element Group (TEG) chips that intentionally incorporated full (complete) open defects and electrically measured the output signals relevant to its defective lines in order to create a new model for open fault behavior. This study reveals the effect boundary of adjacent signal lines on the line containing the full open defect for the first time using the TEG chips.