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A Rare Case of Bronchogenic Cyst Mistaken for Adrenal Tumor
Hae Do Jung(정해도),Ill Young Seo(서일영) 대한비뇨기종양학회 2019 대한비뇨기종양학회지 Vol.17 No.3
Bronchogenic cysts are rare congenital malformations, most often occurring in the pulmonary parenchyma or posterior mediastinum. But they can develop in the ectopic area, especially in the retroperitoneal space. We report a case of adrenal bronchial cyst treated with laparoscopic excision. A 55-year-old woman was admitted with a left adrenal tumor on computed tomography during a study for dyspnea, cough, and sweats. The function of the adrenal glands was examined, and as a result, the adrenal tumors were determined to be nonfunctional. Magnetic resonance imaging showed about an 8-cm-sized large unilocular cystic lesion with mild and high signal intensities at left suprarenal fossa on T1 and T2 images. Iodine-123 metaiodobenzylguanidine scan showed no scintigraphic evidence of neuroendocrine tumor in the left adrenal gland. We performed laparoscopic adrenalectomy with transperitoneal approach. The round, cystic mass was completely excised saving normal adrenal tissues. The operative time was 75 minutes and there was no definitive bleeding and complication. The pathologic tissue weighed 35 g and measured 88 mm×45 mm×28 mm, and cystic changes were observed on the cut surface. The pathologic examination confirmed an adrenal bronchogenic cyst. We report a very rare disease, adrenal bronchial cyst, which could be easily and safely treated with laparoscopic surgery.
생체적합형 고분자를 이용한 박막형 이동기의 제작 및 특성평가
정영대(Young Dae Jung),정해도(Hae Do Jeong) 대한기계학회 2007 대한기계학회 춘추학술대회 Vol.2007 No.5
Electro-active polymer (EAP), one of the smart materials, is a new alternative offering ultra-precise movements and bio-compatibility. We present the results of the design, fabrication, and performance evaluation of a fabricated diaphragm-type polymer actuator using segmented polyurethane(SPU). This paper illustrates the relationship between the elastic modulus and maximum deflection as a key property of the Maxwell stress effect and also presents the relationship between the dielectric constant and maximum deflection as a key property of the electrostriction effect, especially in polymer actuators using SPU. A diaphragm-type actuator was used to induce an equation of the vertically distributed load by using a fully clamped circular plate as the boundary condition. To verify the equation, the results were compared to the data measured from load cell. In the near future, a low-cost check valves and bio-robot can be applied by its actuators.
CMP 패드 강성에 따른 산화막 불균일성(WIWNU)에 관한 연구
박기현,정재우,박범영,서헌덕,이현섭,정해도,Park, Ki-Hyun,Jung, Jae-Woo,Park, Boum-Young,Seo, Heon-Deok,Lee, Hyun-Seop,Jeong, Hae-Do 한국전기전자재료학회 2005 전기전자재료학회논문지 Vol.18 No.6
Within wafer non-uniformity(WIWNU) improves as the stiffness of pad decrease. We designed the pad groove to study of pad stiffness on WIWNU in Chemical mechanical polishing(CMP) and measured the pad stiffness according to groove width. The groove influences effective pad stiffness although original mechanical properties of pad are unchanged by grooving. Also, it affects the flow of slurry that has an effect on the lubrication regime and polishing results. An Increase of the apparent contact area of pad by groove width results in decrease of effective pad stiffness. WIWNU and profile of removal tate improved as effective pad stiffness decreased. Because grooving the pad reduce its effective stiffness and it makes slurry distribution to be uniform. Futhermore, it ensures that pad conforms to wafer-scale flatness variability. By grooving the top pad, it is possible to reduce its stiffness and hence reduce WIWNU and edge effect.
미세 표면 구조물을 갖는 패드의 제작 및 STI CMP 특성 연구
정석훈,정재우,박기현,서현덕,박재홍,박범영,주석배,최재영,정해도,Jeong, Suk-Hoon,Jung, Jae-Woo,Park, Ki-Hyun,Seo, Heon-Deok,Park, Jae-Hong,Park, Boum-Young,Joo, Suk-Bae,Choi, Jae-Young,Jeong, Hae-Do 한국전기전자재료학회 2008 전기전자재료학회논문지 Vol.21 No.3
Chemical mechanical polishing (CMP) allows the planarization of wafers with two or more materials. There are many elements such as slurry, polishing pad, process parameters and conditioning in CMP process. Especially, polishing pad is considered as one of the most important consumables because this affects its performances such as WIWNU(within wafer non-uniformity) and MRR(material removal rate). In polishing pad, grooves and pores on its surface affect distribution of slurry, flow and profile of MRR on wafer. A subject of this investigation is to apply CMP for planarization of shallow trench isolation structure using microstructure(MS) pad. MS pad is designed to have uniform structure on its surface and manufactured by micro-molding technology. And then STI CMP performances such as pattern selectivity, erosion and comer rounding are evaluated.