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리튬전지용 Dimercaptan - Polyphenylenediamine 정극의 제막특성
박수길,이주성 ( Soo Gil Park,Ju Seong Lee ) 한국공업화학회 1997 공업화학 Vol.8 No.1
합성한 Polyphenylenediamine(PPD)와 2,5-dimercapto-1,3,4-thiadiazole(DMcT)을 다양한 비율로 혼합한 뒤 고분자 필름전지용 정극활물질을 제막하였다. 제막한 복합전극에 대해 SEM을 이용하여 도핑 전과 후의 표면구조의 변화를 관찰하였으며, 열적 안정성은 TGA를 이용하여 조사하였다. 또한 전기화학적 특성은 cyclic voltammetry를, 전기전도도는 dry box내에서 four-probe method를 이용하여 측정하였다. 제막한 필름의 열적 안정성은 200℃ 이상이었으며, 전기전도도는 DMSO에서 제막한 후, 0.4% LiClO₄로 도핑한 필름의 전기전도도가 가장 우수하였으며, 이 때의 값은 약 3S/cm이었다. 또한, 전기화학적 특성을 조사하여, DMcT가 PPD의 전기화학적 활성에 영향을 미침을 확인할 수 있었다. The positive active material for polymer film-battery was prepared by using polyphenylenediamine (PPD) synthesized in our lab. and 2,5-dimercapto-1,3,4-thiadiazole(DMcT) with various mixture ratio. The transference measurement of surface morphology and thermal stability of the prepared composite film was carried out by using SEM and TGA, respectively. Electrochemical property and electrical conductivity of the composite film were also measured by using cyclic voltammetry and four-probe method in dry box, respectively. The thermal stability of prepared composite film was up to 200℃. The electrical conductivity of the composite film increased and showed the highest value(about 3 S/cm) when doped at 0.4% LiClO₄, solution. And we could confirm that DMcT was effective on reactivation of PPD through cyclic voltammogram.
로다민과 TPD 혼합형 유기초박막의 EL 소자의 표면특성
박수길,조성렬,손원근,이창진,조병호,임기조,이주성 ( Soo Gil Park,Seong Ryoul Cho,Won Keun Son,Chang Jin Lee,Byung Ho Cho,Kee Joe Lim,Ju Seong Lee ) 한국공업화학회 1997 응용화학 Vol.1 No.1
High performance organic electroluminescent(EL) devices which are composed of organic thin multilayer films are fabricated. The basic structure is hole-transport layer, emitting layer and electron transporting layer. The hole-transporting layer is an amorphous diamine film in which the only mobile carrier is the hole. The emitting layer is consisted of a host material(Alq3) and a guest emitting materials(Rhodamine 101 perchro-late(Red3)). The microscopic study on emitting layer was performed by confocal image system. In this study, we could good result with varing the thickness of emitting layer, 100Å of emitting layer with 3% of Red3 had a 2.3E+0.4(Alq3) and 1.65E(Red3) of EL, at 11V, operating voltage.
박수길,박종은,정승준,엄재석,전세호,이주성,Park Soo-Gil,Park Jong-Eun,Jung Seung-Jun,Yum Jae-Suk,Jun Sae-ho,Lee Ju-Seong 한국전기화학회 1999 한국전기화학회지 Vol.2 No.3
최근 large scale integrated circuits(LSI) 및 printed circuit board(PCB)의 세밀화가 전자기기의 소형화로 인하여 필수 불가결하게 되었다. 전해 도금은 LSI및 PCB의 전도도 및 부식저항을 향상시키기 위해서 전도성 라인의 말단에 적용되고 있다. 그러나 회로 기판의 소형화 및 고직접화로 인하여 적용되지 못하고 있다. 따라서 최근 무전해 도금은 복잡한 장치와 외부에서 전원을 필요치 않는 작동의 간편함 때문에 매우 각광 받고 있는 방법 중의 하나이다. 본 연구는 무전해 니켈/금도금의 도금 기술 개발을 위해 시험하였다. 무전해 니켈 도금은 $85^{\circ}C$의 도금 욕에서 PCB기판 위에 침적 시켰고 그 다음 금층은 동일한 방법으로 $90^{\circ}C$에서 니켈 층위에 침적 시켰다. Bonderbility는 무전해 니켈/금도금의 안정성을 평가하기 위해 gold wire 또는 solder ball 테스트로 실험하였다. Recently, miniaturization of large scale integrated circuits (LSI) and printed circuit board (PCB) have become essential with the downsizing of electronic devices. Gold electroplating is applied of conductivity wiring or terminals for improvement of conductivity and corrosion resistance. However, electroplating is not applicable since the circuits are becoming finer and denser. Accordingly, electroless plating is recently highly attractive method because of the simplicity of the operation requiring no external source of current and no elaborate equipment. In this work, we tried to develop a plating technique on electroless Ni/Au plating. First, the electroless Ni plating was deposited on the PCB with agitation in the bath at $85^{\circ}C$. Then the Au layer was deposited on the Ni layer surface by same method at $90^{\circ}C$. The bonderability were tested in order to evaluate the stability of the electroless Ni/Au by gold wire or solder ball test.
박수길,김종진,손원근,이창진,임기조,이주성 ( Soo Gil Park,Jong Jin Kim,Won Keun Son,Chang Jin Lee,Kee Joe Lim,Ju Seong Lee ) 한국공업화학회 1997 응용화학 Vol.1 No.1
Polymeric solid electrolytes have great advantages over liquid electrolytes in many respects such as high energy density, leak-proof, light weight, easy handling and wide range of operation temperature. This study was concentrated to research and develop solid polymer electrolyte(SPE) for Li secondary battery. We investigated the effects of lithium salt concentration, temperature dependence of conductivity and thermal stability of polyethylene oxide(PEO) electrolytes. The PEO electrolyte complexed with LiClO₄, at [EO]/[Li^+]ratio is 8, showed successful high conductivity(about 10^(-5)S/㎝) at 25℃ than other solvents.
유기황화합물 - Polyphenylenediamine 고분자 필름의 제막 특성
박수길,박종은,손원근,임기조,이주성 ( Soo Gil Park,Jong Eun Park,Won Keun Son,Kee Joe Lim,Ju Seong Lee ) 한국공업화학회 1997 응용화학 Vol.1 No.1
Polyphenylenediamine(PPD) film was prepared with organo sulfur compond (2-aminothiophenol, 1,2-ethanedithiol, and 2-aminoethaneethiol) adding lithium salt to increase conductivity for the case fo lithium secondary systhem. The thermal stability and morphology of conductive polymer synthesized were detcted by using SEM, TGA, DSC analysis. The elecrical conductivity were measured by four-probe method at N₂ atmosphere dry box. The electrical conductivity was showed good valuable about 1.2 x 10¹S/㎝ at room temperature.