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Field Emission Display 용 진공 패키징시 진공하에서 유리 두께에 따른 유리에 걸리는 응력 및 변위(Spacer가 없는 경우)
김희수,문제도,오재열,조영래,김진상,정재은,정효수 한국마이크로전자및패키징학회 1997 하이브리드마이크로일렉트로닉스 Vol.4 No.2
Stress developed in the glass plate during vacuum packaging of an FFD (Field Emission Display) was calculated. Bending stress was derived from the bending moment of the glass plate experiencing bending in the condition of built in edge. Fracture behaviour of the glass plate was observed and the displacement at the center was also measured. Vercuum packaging experiments were carried cut on 3.7$quot; and 5.7$quot; panels. 'floe fracture behavior of the evacuated panel was explained using the bending stress which was derived on the assumption that all edges of the gins were built in.