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고충격성 PP-LFT 소재를 이용한 RE-EV 차량용 CCB 개발
김범호(Beomho Kim),권오민(Omin Kwon),곽성복(Sungbok Kwak),이재용(Jeayong Lee),최현우(Hyeonwoo Choi),김유용(Yooyong-Kim),고윤기(Younki Ko),김용(Yong Kim) 한국자동차공학회 2013 한국자동차공학회 부문종합 학술대회 Vol.2013 No.5
국내외 자동차 산업전반에 있어, 환경법규의 강화와 경량화 문제는 최고의 관심사가 되고 있다. 이러한 이유로 경량화 소재 즉, 열가소성 장섬유 강화 폴리프로필렌(이하 PP-LFT)의 연구가 활발히 진행 중이다. 이 연구에서는 Cowl Cross Bar(이하 CCB)의 국내외 개발동향을 소개하고, CCB의 대체소재로 PP-LFT를 소개하였다. 본 연구에서는 PP-LFT의 함침수지에 polyolefin elastomer(이하 POE)을 첨가하여 특성을 조절 하였고, PP에 Long Glass Fiber(이하 LGF)가 도입된 사출 성형이 가능한 PP-LFT를 제조하여 목표 수준을 만족하는 소재를 확보하였고, 성형해석을 통해 CCB로서 이용되는 부분에 대하여 기술하였다. 마지막으로 본 연구에서 개발된 PP-LFT를 CCB 대체 소재로 적용 시 중량절감 효과에 대해 논하고자 한다.
단결정 실리콘 태양전지의 통계적 접근 방법을 이용한 texturing 공정 최적화
김범호(Kim, Bumho),김회창(Kim, Hoechang),남동헌(Nam, Donghun),조영현(Cho, Younghyun) 한국신재생에너지학회 2010 한국신재생에너지학회 학술대회논문집 Vol.2010 No.11
For reducing outer reflection in mono-crystalline silicon solar cell, wet texturing process has been adapted for long period of time. Nowadays mixed solution with potassium hydroxide and isopropyl alcohol is used in silicon surface texturing by most manufacturers. In the process of silicon texturing, etch rate is very critical for effective texturing. Several parameters influence the result of texturing. Most of all, temperature, process time and concentration of potassium hydroxide can be classified as important factors. In this paper, temperature, process time and concentration of potassium hydroxide were set as major parameters and 3-level test matrix was created by using robust design for the optimized condition. The process optimization in terms of lowest reflection and stable etch rate can be traced by using robust design method.
HaCaT세포에서 TNF-α에 의해 유도되는 MMP-1에 대한 Gallic Aicd의 저해 효과
김범호(Kim, Pom-Ho) 한국산학기술학회 2013 한국산학기술학회논문지 Vol.14 No.11
본 연구는 항주름 소재를 개발하기 위해서 목단피로부터 gallic acid (GA)를 분리하여 항산화능을 측정하였고, HaCaT 세포에서 세포독성을 측정하였다. 또한 HaCaT 세포에서 tumor necrosis factor alpha (TNF-α)에 의해 유도되는 matrix metalloproteinase-1 (MMP-1) mRNA 발현, protein 발현, 분비에 대한 GA의 영향을 관찰하였다. 결과로써 GA는 30 μg/mL의 IC50과 함께 항산화능을 나타내었고, 그것의 항산화능은 합성항산화제인 butylated hydroxyanisol (BHA)보다 높았 다. GA는 HaCaT 세포에서 고농도인 200 μg/mL 처리시 약한 세포독성을 나타내었다. 또한 HaCaT세포에서 TNF-α (10 ng/mL)의 처리에 의해 증가된 MMP-1의 mRNA 발현, protein 발현, 분비는 GA의 처리에 의해 농도 의존적으로 유의적인 감소를 나타내었다(p<0.05). 그러므로 GA는 항산화 효과와 TNF-α로부터 유도되는 MMP-1의 발현을 저해함으로써 피부 주름을 개선할 수 있는 주름개선제로서의 활용가능성을 확인하였다. In order to develop anti-wrinkle agent, we measured the anti-oxidative activity of gallic acid (GA) from Paeonia suffruticosa Andrews and investigated its cytotoxicity in HaCaT cells and then investigated its effect on tumor necrosis factor alpha (TNF-α)-induced matrix metalloproteinase-1 (MMP-1) mRNA, protein expressions and secretion in same cells. GA showed anti-oxidative activity with IC50 of 30 μg/mL and its activity was higher than that of butylated hydroxyanisol (BHA). GA showed weak cytotoxicity with high concentration (200 μg/mL) in HaCaT cells. MMP-1 mRNA, protein expression and secretion induced by tumor necrosis factor alpha (TNF-α) in HaCaT cells were significantly decreased by treatment of GA with dose-dependent manner(p<0.05). Therefore, our findings suggest that GA can be useful as an active ingredient for cosmeceuticals of anti-wrinkle effects.
랫트의 신장 내 카드뮴 축적에 대한 감두탕(甘豆湯)의 방어 효과
김범호(Kim, Pom-Ho) 한국산학기술학회 2011 한국산학기술학회논문지 Vol.12 No.5
카드뮴의 신장 내 축적에 대한 감두탕 투여의 억제효과를 알아보고자 흰쥐에 1.7 ㎍/g/day, 3.4 ㎍/g/day 및 6.8 ㎍/g/day의 카드뮴을 투여한 군과 위의 농도별 카드뮴과 감두탕을 혼합투여한 군과의 체중 변화, 신장의 카드뮴 축적량 및 신장조직의 병리학적 소견을 비교 분석하였다. 그 결과 대조군과 각 실험군의 체중은 감두탕을 투여하지 않은 군은 대조군보다 유의하게 감소하는 경향을 보였으나 감두탕을 투여한 군에서는 유의한 차이를 보이지 않았다. 신장 중의 카드뮴 축적량은 모든 군에서 1주, 2주는 감두탕을 투여한 군이 감두탕을 투여하지 않은 군보다 증가하는 경향이었고, 4주, 8주에서는 감두탕을 투여하지 않은 군이 감두탕을 투여한 군보다 증가하는 경향이었다. 신장조직의 병리조직학적 관찰 결과, 감두탕을 투여하지 않은 군은 사구체의 출혈성 괴사, 뇨세관의 종창, 상피세포의 탈락 및 뇨 세관의 괴사가 관찰되었으나 감두탕을 투여한 군에서는 조직병변이 미약하게 관찰되었다. 이상과 같은 결과를 볼 때, 감두탕은 저농도의 카드뮴이 생체 내에 투여될 때 흰쥐의 신장 내 축적되는 카드뮴을 어느 정도 억제시키는 효과가 있는 것으로 판단된다. To find out the protective effects of Kamdootang against accumulation of cadmium in rats, the experimental rats were divided into 2 groups. One group was administered with cadmium alone and the other group administered with cadmium mixed with Kamdootang. Each group has been orally administered with different doses of cadmium such as 1.7 ㎍/g/day, 3.4 ㎍/g/day and 6.8 ㎍/g/day, respectively, for 1 to 8 weeks. As a results, body weight gained has a tendency to decrease more in the Kamdootang treated groups and non-treated groups than in control group. Cadmium accumulation in kidney showed a significant difference between the Kamdootang treated group and Kamdootang non-treated group. As the experiment period is longer and longer, both groups have got more significantly cadmium accumulation amounts. The kidney system was researched through histopathological observation that Multiple foci of necrosis, hemorrhagic necrosis in glomeruli and cloudy swelling of tubules in kamdootang non-treated group. but tissue lesion of kidney was showed less kamdootang treated group than Kamdootang non-treated group. As remarked above results, when dose low concentrated Cd in rat, Kamdootang was reduced accumulation of Cd. in kidney.
결정질 실리콘 태양전지에 적용하기 위한 도금법으로 형성환 Ni/Cu 전극에 관한 연구
김범호(Kim, Bum-Ho),최준영(Choi, Jun-Young),이은주(Lee, Eun-Joo),이수홍(Lee, Soo-Hong) 한국신재생에너지학회 2007 한국신재생에너지학회 학술대회논문집 Vol.2007 No.06
An evaporated Ti/Pd/Ag contact system is most widely used to make high-efficiency silicon solar cells, however, the system is not cost effective due to expensive materials and vacuum techniques. Commercial solar cells with screen-printed contacts formed by using Ag paste suffer from a low fill factor and a high shading loss because of high contact resistance and low aspect ratio. Low-cost Ni and Cu metal contacts have been formed by using electroless plating and electroplating techniques to replace the Ti/Pd/Ag and screen-printed Ag contacts. Ni/Cu alloy is plated on a silicon substrate by electro-deposition of the alloy from an acetate electrolyte solution, and nickel-silicide formation at the interface between the silicon and the nickel enhances stability and reduces the contact resistance. It was, therefore, found that nickel-silicide was suitable for high-efficiency solar cell applications. The Ni contact was formed on the front grid pattern by electroless plating followed by anneal ing at 380{sim}400?C for 15{sim}30 min at N_{2} gas to allow formation of a nickel-silicide in a tube furnace or a rapid thermal processing(RTP) chamber because nickel is transformed to NiSi at 380{sim}400?C. The Ni plating solution is composed of a mixture of NiCl_{2} as a main nickel source. Cu was electroplated on the Ni layer by using a light induced plating method. The Cu electroplating solution was made up of a commercially available acid sulfate bath and additives to reduce the stress of the copper layer. The Ni/Cu contact was found to be well suited for high-efficiency solar cells and was successfully formed by using electroless plating and electroplating, which are more cost effective than vacuum evaporation. In this paper, we investigated low-cost Ni/Cu contact formation by electroless and electroplating for crystalline silicon solar cells.
습식 화학 식각에 의한 다결정 실리콘 웨이퍼의 표면 텍스쳐링
김범호(Bum-ho Kim),이현우(Hyun-woo Lee),이은주(Eun-joo Lee),이수홍(Soo-hong Lee) 한국태양에너지학회 2006 한국태양에너지학회 학술대회논문집 Vol.- No.-
Two methods that can reduce reflectance in solar cells are surface texturing and anti-reflection coating. Wet chemical etching is a typical method that surface texturing of multi-crystalline silicon. Two kinds of silicon surface texturization of multi-crystalline silicon obtained by wet chemical etching are investigated in view of implementation in the solar cell processing. The first one was the acid texturization of saw damage on the surface of multi-crystalline silicon. The second one was porous texturization prepared by double-step chemical etching after KOH saw damage layer was previously removed. These methods of surface texturing are realized by chemical etching in acid solutions HF-HNO₃-H₂O or HF-HNO₃-CH₃COOH. In this solutions we can reduce reflectance spectra by simple process etching of multi-crystalline silicon surface. We have obtained reflectance of 26.74% in 400~1100㎚ from acidic chemical etching after KOH saw damage removal. This result is about 8% less than just saw damage removal substrate. The surface morphology observed by microscope and scanning electron microscopy (SEM).