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鄭載天,金敬年,金基先 한국비파괴검사학회 1991 한국비파괴검사학회지 Vol.11 No.2
This paper is to analyze the surface roughness in wet and dry surface grinding in which working conditions are table feed, cross feed and down feed. FFT analyzer is used to identify the surface roughness and the data of surface roughness are stored and displayed using an interfaced computer. In results. components affecting surface roughness exist within 200Hz with respect the conditions and methods of grinding operation. Also, with increase of table feed, cross feed and down feed, the value of surface roughness increases. Of them, cross feed has first influence on surface roughness. In dry, preciser surface can be obtained than one in wet.
로타리 연삭에 대직경 Si-wafer의 ELID 경면 연삭특성
박창수,김원일,이윤경,왕덕현,김경년 한국공작기계학회 2002 한국공작기계학회 춘계학술대회논문집 Vol.2002 No.-
Mirror surface finish of Si-wafers has been achieved by rotary in-feed machining with cup-type wheels in ELID grinding. But the diameter of the work piece is limited with the diameter of grinding wheel in the in-feed machining method. In this study, grinding experiments by the rotary surface grinding machine with straight type wheels were conducted, by which the possible grinding area of the work piece is independent of the diameter of the wheels. For the purpose of investigating the grinding characteristics of large scale diametrical silicon wafer, grinding conditions such as rotation speed of grinding wheels and revolution of work pieces are varied, and grinding machine used in this experiment is rotary type surface grinding m/c equipment with an ELID unit. The surface ground using the SD8000 wheels showed that mirror like surface roughness can be attained near 2~6 nm in Ra.