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한재호,이재봉,Nguyen Van Phuong,김동현 한국부식방식학회 2022 Corrosion Science and Technology Vol.21 No.2
A versatile method for performing non-cyanide electroless gold plating using thiomalic acid (TMA) as acomplexing agent and 2-aminoethanethiol (AET) as a reducing agent was investigated. It was found thatTMA was an excellent complexing agent for gold. It can be used in electroless gold plating baths at a neutral pH with a high solution stability, makes it a potential candidate to replace conventional toxic cyanide complex. It was found that one gold atomic ion could bind to two TMA molecules to form the [2TMAAu +] complex in a solution. AET can be used as a reducing agent in electroless gold plating solutions. The highest current density was obtained at electrode rotation rate of 250 to 500 rpm based on anodic and cathodic polarization curves with the mixed potential theory. Increasing AET concentration, pH, and temperature significantly increased the anodic polarization current density and shifted the plating potential toward a more negative value. The optimal gold ion concentration to obtain the highest current density was 0.01 M. The cathodic current was higher at a lower pH and a higher temperature. The current density was inversely proportional to TMA concentration.
적응제어기법을 이용한 다자유도 진동모델의 위치 및 자세결정에 관한 연구
한재호,김재열,오환교 한국자동차공학회 1993 한국자동차공학회 춘 추계 학술대회 논문집 Vol.- No.-
To present the dynamic interference and response variation subjected to mass load for the object of six-degrees of freedom of vibration model, the result obtained are as follows:<br/> <br/> I) In the case of the object subjected to mass load, the experimentation is carried out on two-degrees of freedom of translation (one direction) and revolution(one direction).<br/> It is confirmed that kinetic equation is reasonable by ascertaining that interference of 0.19 arcsec occurs for the input of translation, 0.1 lμm and interference of 0.022μm does for the input of revolution, 0.5 arcsec.<br/> <br/> 2) In the case of making the operation of transfer matrix analog circuit, simulation is carried out by differentiating incomplete signal seleted by optional choice. ; so it is ascertained that the theory responses are almost accord wi th the experiment response by finding interference of 1. 7xl0 ̄³arcsec for the input of revolution, 0.1μm and interference of 1.4x10 ̄⁴ for the input of translation, 0.5 aresec on open-loop system.<br/>
티오말산을 착화제로 하고 아미노에탄티올을 환원제로 하는 비시안계 무전해 Au 도금액의 석출 거동 및 도금 특성
한재호,김동현 한국표면공학회 2022 한국표면공학회지 Vol.55 No.2
Gold plating is used as a coating of connecter in printed circuit boards, ceramic integrated circuit packages, semiconductor devices and so on, because the film has excellent electric conductivity, solderability and chemical properties such as durability to acid and other chemicals. As increasing the demand for miniaturization of printed circuit boards and downsizing of electronic devices, several types of electroless gold plating solutions have been developed. Most of these conventional gold plating solutions contain cyanide compounds as a complexing agent. The gold film obtained from such baths usually satisfies the requirements for electronic parts mentioned above. However, cyanide bath is highly toxic and it always has some possibility to cause serious problems in working environment or other administrative aspects. The object of this investigation was to develop a cyanide-free electroless gold plating process that assures the high stability of the solution and gives the excellent solderability of the deposited film. The investigation reported herein is intended to establish plating bath composition and plating conditions for electroless gold plating, with thiomalic acid as a complexing agent. At the same time, we have investigated the solution stability against nickel ion and pull strength of solder ball. Furthermore, by examining the characteristics of the plated Au plating film, the problems of the newly developed electroless Au plating solution were improved and the applicability to various industrial fields was examined. New type electroless gold-plating bath which containing thiomalic acid as a complexing agent showing so good solution stability and film properties as cyanide bath. And this bath shows the excellent stability even if the dissolved nickel ion was added from under coated nickel film, which can be used at the neutral pH range.
캐피라리 전기 영동법에 의한 비시안 무전해 Au 도금액의 분석
한재호,김동현 한국표면공학회 2022 한국표면공학회지 Vol.55 No.2
In the non-cyanide-based electroless Au plating solution using thiomalic acid as a complexing agent and aminoethanethiol as a reducing agent, analysis of each component constituting the plating solution is essential for the analysis of the reaction mechanism. And component analysis in the plating solution is important for monitoring component changes in the plating process and optimizing the management method.