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열처리 조건이 보론첨가강의 결정립계 석출물형상과 조성에 미치는 영향
정인상,조삼규 대한금속재료학회(대한금속학회) 1993 대한금속·재료학회지 Vol.31 No.9
Effects of cooling rate, quenching temperature and holding time on the morphology and the composition of the precipitates at the prior austenite grain boundary were investigated in boron steel. Morphology of the precipitate was plate type and independent of quenching temperature and holding time. But the increase in the cooling rate decreases the thickness and length of the precipitates. The precipitate at the prior austenite grain boundary was Fe₃(CB) and independent of cooling rate, quenching temperature and holding time. Boron content in Fe₃(CB) was 7.5at% at 20℃/sec and 11.0 at% at 1℃/ sec.
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NiAl 계 형상기억합금의 미세조직과 연성에 미치는 Fe, Mn 첨가의 영향
정인상,최창수 대한금속재료학회(대한금속학회) 1999 대한금속·재료학회지 Vol.37 No.2
The purposes of this study are to clarify effects of Fe. Mn alloying on microstructure and ductility of the NiAl base shape memory alloys. It has been found that the γ phase formed by the alloying Fe or Fe+Mn has a drastic effect not only on the hot workability but also on the tensile ductility at room temperature. The enhancement in ductility is mainly due to presence of the γ phase with a high ductility and grain refinement of the β phase by the adjacent γ phase for annealing. The specimens quenched from 1300℃ consisted of the β′(L1_0) and r(disorded fcc). The β′ martenste have a {111} $lt;112$gt; internal twins. The c/a value of the β′ phase is 0.86-0.87, almost equal to that of the binary Ni-Al β′ phase. And the lattice parameter of the γ phase is 0.358-0.359㎚.
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열사이클에 따른 Cu-Zn-Al 형상기억합금의 형상기억능, 조직 및 결정구조변화
정인상,박경채,이성 대한금속재료학회(대한금속학회) 1988 대한금속·재료학회지 Vol.26 No.11
The shape memory ability, microstructure and crystal structure in Cu-21.30Zn-5. 36Al(wt.%) shape memory alloy have been extensively studied as a function of thermal cycling. Crystal structure of quenched alloy is M18R(β₁') martensite, and it become fragmentary with increasing thermal cycles. Shape memory ability is decreased and stress-induced 2H(γ₁') martensite and residual parent (DO₃) phase are founded during thermal cycling. Reversible shape memory effect is occurred according to thermal cycling at 473K, in which martensite plate, only 18R structure, is occurred incorporation and intersection.
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유전자 알고리즘을 이용한 뮤테이션 테스팅의 테스트 데이터 자동 생성
정인상,창병모 한국정보처리학회 2001 정보처리학회논문지D Vol.8 No.1
소프트웨어 테스팅의 중요 목표 중의 하나는 '좋은' 테스트 데이터 집합을 생성하는 것으로 이는 매우 어렵고 시간이 걸리는 작업이다. 본 논문은 소프트웨어 테스팅을 위한 자동 테스트 데이터 집합 생성에 유전자 알고리즘을 적용하는 방법을 제시하며 자동 테스트 데이터 생성에서 유전자 알고리즘의 효용성을 보이기 위해 유테이션 테스팅을 도입한다. 본 연구는 테스트 데이터 생성 과정이 테스트 대상 프로그램의 구현에 대한 지식을 필요로하지 않는다는 점에서 다른 방법들과 다르다. 또한, 제안된 방법의 효율성을 보이기 위하여 몇 가지 실험을 통해서 블랙박스 테스트 생성 기법은 랜덤 테스팅과 비교한다. one key goal of software testing is to generate a 'good' test data set, which is consideres as the most difficult and time-consuming task. This paper discusses how genetic algorithns can be used for automatic generation of test data set for software testing. We employ mutation testing to show the effectiveness of genetic algorithms (GAs) in automatic test data generation. The approach presented in this paper is different from other in that test generation process requireas no lnowledge of implementation details of a program under test. In addition, we have conducted some experiments and compared our approach with random testing which is also regarded as a black-box test generation technique to show its effectiveness.
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정인상,이인철,박정식,이순린 ( In Sang Chung,In Chul Lee,Jung Sig Park,Soon Lin Lee ) 한국열처리공학회 1990 熱處理工學會誌 Vol.3 No.2
Since the reverse shape memory effect(RSME) was reported in a CuZnAl alloy, further study has been done on the mechanism of this phenomenon and reported that it occurs by the bainitic transformation. But the present authors revealed in the previous work that the RSME in a B2 CuZnAl alloy is not caused by the shear process involved in the bainitic transformation and also that the RSME takes place as the remaining α`₂phase, which is two-step transformed strain induced martensite, is newly transformed into α phase. In order to provide further evidence in supporting the facts, thus, more detailed investigations have been carried out in a DO₃CuZnAl alloy.
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정인상,박지환,황종수,최원희,Jung, Insang,Park, Jihwan,Hwang, Jongsoo,Choi, Wonhee 한국자원리싸이클링학회 2015 자원리싸이클링 Vol.24 No.4
The importance of recycling came to the fore by increasing of waste electrical and electronic equipment(WEEE) generation. Small WEEE recycling in particular represents a big challenge in Korea because it has various items and components. Main materials of small WEEE are typically well known for metals (copper, iron, aluminum, etc.), PCBs and plastics. Not only Korea but also overseas, the laws for small WEEE were in effect in order to recycle effectively, but the technology is not catched up with the regulation which has to recycle an allocated account of WEEE. In addition, recycling technologies and processes for small WEEE are not developed enough to recycling center properly. In that sense, if we develope the recycling process, have not only technology competitiveness but also resource conservation, improving the environment and economic profits. Therefore, through the analysis of economic value of recycled small WEEE, and current technologies both domestically and internationally, we design conceptual recycling process of small WEEE, and consider the way forward.
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Iodide/Iodine용액에서 CPU chip 분쇄물의 금 침출특성
정인상,조아람,최준철,송유진,박풍원,박경호,이수정,박재구,Jung, Insang,Joe, Aram,Choi, Joonchul,Song, Youjin,Park, Poongwon,Park, Kyungho,Lee, Sujeong,Park, Jaikoo 한국자원리싸이클링학회 2016 자원리싸이클링 Vol.25 No.1
The leaching behavior of gold from waste CPU chip using Iodide/Iodine solution was studied. The direct leaching of gold with Iodide/Iodine solution for CPU chip under the size of 150 mesh showed leaching ratio of 20%. It was assumed that the copper film was produced on the gold particle during grinding process and the copper film prevents lodine/Iodide solution from contacting with leachable gold. Meanwhile, the extraction of gold was improved to 90% by pretreatment process with $HNO_3$ solution. In order to explain the result, EDS and ICP analysis for the leaching residue were conducted. It was found that the copper coated on the surface of the gold particle was removed about 80% by $HNO_3$, resulting in the increment of gold leaching rate.
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