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      • KCI등재

        외기 오존 농도에 따른 반도체 작업환경 및 사무실에서의 오존 농도 변화 연구

        이지은 ( Ji-eun Lee ),정명구 ( Myung-koo Jung ),최광민 ( Kwang-min Choi ) 한국산업보건학회 (구 한국산업위생학회) 2016 한국산업보건학회지 Vol.26 No.2

        Objectives: The purpose of this study was to evaluate the ozone exposure levels and the variations in ozone concentration in asemiconductor fabrication facility and office in relation to the ozone concentration in the outdoor air. Methods: This study was performed in an office, semiconductor fabrication facility(such as etching, diffusion, diffusion plenum),and outdoors from June to August, 2015. Measurements were taken six times at the same places using an active sampler(pumped)and real-time equipment. Ozone monitoring by the active sampler method and analysis were carried out by OSHA MethodID-214. Real-time measurement was carried out by ozone measuring equipment using a non-dispersive ultraviolet absorption method. Results: Ozone concentrations in the semiconductor fabrication facility and office were 0.7~7.1 ppb in area samples and0.72~4.07 ppb in real-time measurement, which were 0.88~8.88% of the occupational exposure limit. The concentration of ozonegenerated by a laser printer in the office was less than 2 ppb. There was not a significant difference between ozone concentrations before and after using the laser printer. The indoor/outdoor concentration ratio(I/O ratio) in the semiconductor fabrication facility and office was 0.05 and 0.06, respectively. Conclusions: All the samples contained ozone levels lower than the occupational exposure limit and it was confirmed that the concentration of outdoor ozone had no significant effect on indoor ozone concentration

      • KCI등재

        반도체 메탈공정 및 1차 스크러버에서 생성되는 파우더 부산물의 물리화학적 특성분석

        최광민 ( Kwang Min Choi ),정명구 ( Myung Koo Jung ),안희철 ( Hee Chul An ) 한국산업보건학회 2015 한국산업보건학회지 Vol.25 No.3

        Objectives: The aim of this study is to identify physicochemical properties such as chemical composition, size, shape and crystal structure of powder byproducts generated from a metallization process and its 1st scrubber in the semiconductor industry. Methods: Powder samples were collected from inner chambers during maintenance of the W-plug process equipment (using tungsten hexafluoride as a precursor material) and its 1st scrubber. The chemical composition, size and shape of the powder particles were determined by field emission scanning electron microscopy (SEM) and transmission electron microscopy (TEM) equipped with an energy dispersive spectroscope (EDS). The crystal structure of the powders was analyzed by X-ray diffraction (XRD). Results: From the SEM-EDS and TEM-EDS analyses, O and W were mainly detected, which indicates the powder byproducts are tungsten trioxide (WO3), whereas Al, F and Ti were detected as low peaks. The powder particles were spherical and nearly spherical, and the particle size collected from the process equipment and its 1st scrubber showed 10-20 nm (agglomerates: 55-90 nm) and 16-20 nm (agglomerates: 80-120 nm) as primary particles, respectively. The XRD patterns of the yellow powder byproducts exhibit five peaks at 23.8 33.9 41.74 48.86 and 54.78 which correspond to the (200), (220), (222), (400), and (420) planes of cubic WO3. Conclusions: We elucidated the physicochemical characteristics of the powder byproducts collected from W-plug process equipment and its 1st scrubber. This study should provide useful information for the development of alternative strategies to improve the working environment and workers`` health.

      • KCI등재

        탈착용매에 따른 PAHs 흡착매체의 탈착효율 평가 연구

        홍좌령 ( Jwa-ryung Hong ),이지은 ( Ji-eun Lee ),정명구 ( Myung-koo Jung ),최광민 ( Kwang-min Choi ) 한국산업보건학회 (구 한국산업위생학회) 2016 한국산업보건학회지 Vol.26 No.3

        Objectives: In general, NIOSH method 5506 is most widely used for the occupational exposure measurement of PAHs, but 2-4 ring PAHs have poor desorption efficiency, especially for a filter. The purpose of this study was to determine a method to increase the desorption efficiency of 16-PAHs using an ultrasonic extraction procedure. Methods: Test samples prepared spiked XAD-2 tubes and PTFE filters in the range of 0.01-1.0 ㎍/mL for desorption efficiency study. Four different extraction solvents, acetonitrile, acetone, tetrahydrofuran and dichloromethane, were tested in order to select the most suitable solvent for the extraction of the 16 PAHs. The addition of dimethyl sulfoxide and sonication time were considered in order to determine the method with the highest extraction efficiency. All samples were made in three sets and analysis was replicated seven times by HPLC. Results: Acetonitrile and acetone were the optimized as an extraction solvent and desorption efficiency of 2-ring PAHs such as naphthalene, acenaphthylene were increased 3~19% with dimethyl sulfoxide for XAD-2. Acetone was the best extraction solvent for PTFE filter and the desorption efficiency was increased 3~13% for 2- to 4-ring PAHs. The optimum sonication time was 60 minutes and desorption efficiency increased with extraction time. Conclusions: As a result, the best extraction solvent was acetone with dimethyl sulfoxide for ultrasonic extraction procedure and the desorption efficiency of this method was better than NIOSH 5506’s. This study could be applied as a method for occupational exposure measurement of PAHs.

      • KCI등재

        반도체 작업환경 내 부산물로 생성되는 실리카 입자의 크기, 형상 및 결정 구조

        최광민 ( Kwang Min Choi ),여진희 ( Jin Hee Yeo ),정명구 ( Myung Koo Jung ),김관식 ( Kwan Sick Kim ),조수헌 ( Soo Hun Cho ) 한국산업보건학회 2015 한국산업보건학회지 Vol.25 No.1

        Objectives: This study aimed to elucidate the physicochemical properties of silica powder and airborne particles as by-products generated from fabrication processes to reduce unknown risk factors in the semiconductor manufacturing work environment. Materials and Methods: Sampling was conducted at 200 mm and 300 mm semiconductor wafer fabrication facilities. Thirty-two powder and airborne by-product samples, diffusion(10), chemical vapor deposition(10), chemical mechanical polishing(5), clean(5), etch process(2), were collected from inner chamber parts from process and 1st scrubber equipment during maintenance and process operation. The chemical composition, size, shape, and crystal structure of silica by-product particles were determined by using scanning electron microscopy and transmission electron microscopy techniques equipped with energy dispersive spectroscopy, and x-ray diffractometry. Results: All powder and airborne particle samples were composed of oxygen(O) and silicon(Si), which means silica particle. The by-product particles were nearly spherical SiO2 and the particle size ranged 25 nm to 50 μm, and most of the particles were usually agglomerated within a particle size range from approximately 25 nm to 500 nm. In addition, the crystal structure of the silica powder particles was found to be an amorphous silica. Conclusions: The silica by-product particles generated from the semiconductor manufacturing processes are amorphous SiO2, which is considered a less toxic form. These results should provide useful information for alternative strategies to improve the work environment and workers‘ health.

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