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경사형 간극의 각도 및 높이가 고발열 냉각용 이상 냉각판의 열성능에 미치는 영향
이정호,황석찬,최준영 한국유체기계학회 2025 한국유체기계학회 논문집 Vol.28 No.5
The rapid growth of GPU integration for AI workloads in modern data centers has intensified power consumption and thermal management challenges. Although single-phase cooling methods such as jet impingement and microchannel systems have been widely explored, their high pumping power demand limits overall energy efficiency. Two-phase cooling, by exploiting phase change, offers superior heat transfer performance; however, reliable operation requires enhancement of the Critical Heat Flux (CHF). Existing approaches largely rely on boiling-enhanced surfaces involving complex fabrication, whereas tapered gap structures provide a simpler alternative. In this study, a pool-boiling-based cooling plate with tapered gap structures was developed to cool high-power chips with reduced pumping power. Experimental investigations revealed that CHF in non-inclined structures increased with gap height, while tapered structures exhibited an optimal gap height. The configuration with H/W = 1 and a 20° inclination achieved the lowest thermal resistance (0.061 K/W), the highest heat transfer coefficient (20,185 W/m²⋅K), and a junction temperature of 191.1°C. Compared with an unstructured case, CHF improved by up to 78% (105 W/cm²). These results demonstrate that tapered gap structures can be effectively optimized in two-phase cold plate designs, providing enhanced thermal performance and design flexibility for next-generation high-power electronic devices.