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원예치료프로그램이 가족공동체 붕괴로 인한 문제행동 아동들의 정서 안정, 사회성 및 자아존중감 증진에 미치는 효과에 관한 연구
이백우 한국꽃예술학회 2017 한국꽃예술학회지 Vol.19 No.-
본 연구는 가족공동체 붕괴로 인하여 정서적 부적응을 보이는 문제행동 아동들에게 원 예치료가 정서 안정, 사회성 및 자아 존중감에 미치는 효과를 검증하기 위한 실험 설계 연구이다. 본 연구의 목표는 생명존중 의식을 바탕으로 대상 아동들의 정서안정, 사회성 및 자아존중감 증진에 두었다. 연구 대상자는 P시의 M초등학교 3학년 A반 아동 22명을 대상으로 실험군 3명, 대조군 19명으로 선정하였다. 자료수집 기간은 2016년 9월 15일부터 2016년 11월 15일까지이다. 대상아동의 심리적 신체적 진단 도구로서 6가지 스트레스 항목 표와 HTP 검사기법을 사 용하였고, 7회기 원예치료 프로그램을 설계하여 적용 실시하였다. 연구의 결과, 7회기의 원예치료를 통하여 아동의 스트레스 지수가 낮아지고, 프로그램 적용 전후의 HTP 검사에서 그림에 변화가 확인되었으며, 원예치료를 통하여 자신감과 분노조절 및 인내심과 같이 긍정적 정서가 증진 및 안정되었으며, 사회성 등이 향상되었 고 아울러 생명존중 의식을 가지게 됨을 알 수 있었다. 향후 학교 현장에서 교과목에 원 예치료를 접목한다면 급우들 간의 관계 개선, 사회성과 학습 능력의 향상을 기대할 수 있다는 데에 있다. The purpose of this study is to examine the effects of horticultural therapy on emotional stability, sociality and self-esteem of children with problem behaviors as the problems of parenting are emerging as a social problem due to emotional maladjustment of children due to family community collapse. This is an experimental design study before and after treatment. The goal of this study was to improve emotional stability, sociality and self-esteem based on respect for life. The subjects of the study were 3 students in the experimental group and 19 students in the control group among 22 students in the 3rd grade of elementary school in P city. The data collection period was from September 15, 2016 to November 15, 2016. Six stress index and HTP test were used as problem diagnosis tools before and after treatment. As results of this study, the stress index of children was lowered through horticultural therapy in 7 sessions, and the change of characteristics in HTP test was confirmed. It was found that horticultural therapy improves self-confidence and control anger, and has patience and a sense of life. In the future, if we apply horticultural therapy to art and practical subjects at the school site, it is meaningful that we can expect to improve relationship among classmates, social skill and learning ability.
도시 및 주택시장 특성을 이용한 지역 노후화 영향 분석
이백우,서정렬 한국문화공간건축학회 2020 한국문화공간건축학회논문집 Vol.- No.70
The purpose of this study was to grasp influence on the aging of the region by the urban and housing market characteristics, based on the background of the research that the aging of the region can affect not only the problem of the reduction of population, but also the urban change on the environmental change of the overall housing market. As a result of the analysis, the variables analyzed for the old-age housing ratio were the elderly population ratio, regional average presale price, Seoul-capital region (dummy), public interest rate, population growth rate (dummy), housing price increase rate, and regional average presale volume. The aging region has a high percentage of the elderly population and the number of vacant homes, and the population continues to decline. These regions have the premise that aging is likely to be complex with the current housing market. These were estimated areas with high aging residential area ratios, including small and medium-sized cities including metropolitan areas except the Seoul metropolitan area. Implications of this study are as follows: First, the continuous decline in the population growth rate is likely to lead to the aging of the region. Second, it is the management and utilization plan according to the increase of the elderly population and the increase of the number of vacant homes. Third, it is necessary to adjust appropriation on the amount of local housing supply that prepare to the regional aging. Therefore, it is necessary to consider urban characteristics and regional housing market characteristics simultaneously and in combination. In particular, it is necessary to find ways to utilize old housing and provide adequate housing considering the local housing market.
레이저 간섭계(ESPI)에 의해 측정된 플립칩 열변형의 유한요소해석 모델링을 통한 솔더볼의 유동곡선 평가
이백우,김주영,나재웅,백경욱,권동일 대한금속재료학회 2003 대한금속·재료학회지 Vol.41 No.6
The goal of this study was to determine the uniaxial flow curve for solder balls in a flip-chip from experimental-computational algorithms based on finite element modeling (FEM) of in-plane thermal displacement data measured by electronic speckle pattern interferometry (ESPI). In order to measure the deformation of such tiny components as the solder balls in the flip-chip, the spatial resolution of ESPI was increased to submicron scale by magnifying the areas studied. The flow curve for solder balls in the flip-chip was determined by the algorithm, which effectively matches the simulated solder deformation by FEM to the measured deformation by ESPI. The algorithms were applied to Sn-36Pb-2Ag flip-chip solder balls. The flow curve obtained for flip-chip solder was compared with those for bulk solder. The microstructure was also studied to clarify the flow curve results.