Disseminated Mycobacterium after use of TNF-α -inhibitor therapy in patients with RA

유아미,천윤홍,이상일,김민교 대한내과학회 2022 대한내과학회 추계학술대회 Vol.2022 No.2

의약품 부작용에 대한 인식도 조사

유아미 고려대학교 대학원 통계학과 2007 통계상담 Vol.사례 20 No.1

임상시험에서의 공변량을 고려한 확률화 방법들의 비교

유아미,이재원,Yu, A-Mi,Lee, Jae-Won 한국통계학회 2010 응용통계연구 Vol.23 No.6

임상시험에서 환자들을 각 처리로 할당할 때 반응변수에 영향을 미치는 공변량이 존재하면 공변량도 함께 고려하여 환자들을 랜덤하게 배치하여야 한다. 확률화(randomization) 방법들에는 여러 가지가 있으나 공변량에 따라 환자들을 배치하는 방법으로 층화(stratification)를 많이 사용한다. 층화는 환자들을 공변량에 따라 여러 층으로 나누고 각 층들 안에서 환자들을 랜덤하게 배치하는 방법인데, 공변량의 수가 많아지면 층의 수가 급격하게 늘어나기 때문에 층마다의 환자수가 충분히 많지 않으면 그 결과를 신뢰할 수 없게 된다. 이를 보완하기 위한 방법으로 Pocock과 Simon (1975)은 최소화(minimization) 방법을 제안하였으며 이 방법은 처리에 대한 공변량의 균형을 맞추는 것에 중점을 두었다. 본 논문에서는 현재 가장 많이 쓰이고 있는 확률화 방법들과 최소화 방법의 장단점, 불균형의 정도 및 검정력을 모의실험 연구를 통해 비교해보고자 한다. In clinical trials, patients should be randomly allocated to treatment and control groups that consider the balance of their prognostic factors(covariates). There are many randomization methods and stratification is popular in Korea. In stratification, patients are divided into strata based on covariates and then the patients are randomly assigned to the arms of each strata. If the number of covariates increases then the number of strata increases rapidly and the results may not be reliable when the patients are inadequate in each strata. To complement this problem Pocock and Simon (1975) suggested a new randomization method that called for minimization focusing on the balance of covariates. In this study, we compare the advantages and disadvantages, the imbalance of covariates, the power of minimization, and other randomization methods by simulation.

부모행복감 검사도구 개발 및 타당화

유아미,이경화 열린부모교육학회 2022 열린부모교육연구 Vol.14 No.4

The purpose of this study was to develop and validate the test instrument of parental happiness. To achieve this, the research questions were set as 'what are the concepts and components of parental happiness' and 'whether the test for parental happiness is valid'. The subjects of this study were 602 parents with children from infancy to adolescents. The procedure of this study is as follows. First, the components and initial questions of the parental happiness test were derived through the content validity of the first expert and the content evaluation of the second expert. Second, exploratory factor analysis and confirmatory factor analysis were conducted with collected data, so the validity of the parental happiness test was verified. The results were as follows. first, parental happiness was defined as emotion that had basic requirements to take care of children as parents, maintained positive relationship with family members, and felt as individuals as parents grew up. Second, as a result of exploratory factor analysis and confirmatory factor analysis, the parent happiness test was composed of 48 final items, in three categories of existence, relationship, growth, and 11 components. Third, the internal consistency and reliability of the questions were analyzed to confirm that the parental happiness test is acceptable. The parent happiness test instrument developed in this study can be used as an evaluation instrument to identify and manage individual happiness as a parent, and it will be helpful for parent role performance because of high parental efficacy. It can also be used as basic data for the development of education programs for parents and couples. 본 연구의 목적은 부모행복감 검사도구를 개발하여 타당화하는 것이다. 따라서 ‘부모행복감의 개념과 구성요인이 무엇인지’, ‘부모행복감 검사도구는 타당한지’를 연구문제로 설정하여 이를 밝혔다. 연구대상은 유아기 자녀를 둔 부모부터 청소년기 자녀를 둔 부모 602명이었다. 검사도구 개발 절차를 살펴보면 첫째, 1차 전문가 내용타당도 검증과 2차 전문가 내용평가를 통해 부모행복감 검사도구의 구성요인과 초기 검사문항을 도출하였다. 둘째, 수집된 데이터로 탐색적 요인분석과 확인적 요인분석 및 구인타당화 작업을 실시하여 부모행복감 검사도구의 타당도를 검증하였다. 연구 결과 첫째 부모행복감의 개념을 ‘부모로서 자녀를 돌볼 수 있는 기본 요건을 갖추고 있고, 가족들과 긍정적인 관계를 유지하면서 부모로서 개인이 성장해가면서 느끼는 정서’로 정의하였다. 둘째, 탐색적 요인분석과 확인적 요인분석의 결과를 통해 부모행복감 검사도구를 존재, 관계, 성장의 세 가지 범주, 11개 구성요인으로 최종 48개 문항으로 구성하였다. 셋째, 문항 내적일관성 확인과 구인타당도 검증을 통하여 부모행복감 검사도구가 수용 가능한 수준임을 확인하였다. 본 연구에서 개발된 부모행복감 검사도구는 부모로서 개인의 행복감을 파악하고 관리하는 자기보고식 평가도구로 사용할 수 있으며, 이를 기반으로 자기점검 및 성찰을 함으로써 부모 역할 수행하기에 도움을 줄 수 있을 것이며, 또한 부모 교육 및 부부 교육 프로그램 개발을 위한 기초자료로 활용될 수 있을 것이다.

플럭스 활성도 및 In 첨가에 따른 Sn-0.3Ag-0.7Cu 솔더 조성의 젖음 특성 변화

유아미,김준기,김목순,현창용,이종현,Yu, A-Mi,Kim, Jun-Ki,Kim, Mok-Soon,Hyun, Chang-Yong,Lee, Jong-Hyun 한국마이크로전자및패키징학회 2008 마이크로전자 및 패키징학회지 Vol.15 No.4

저 Ag 함유 Sn-Ag-Cu계 무연솔더 조성, 즉, Sn-0.3Ag-0.7Cu 조성의 젖음 특성과 반응 특성을 Sn-1.0Ag-0.5Cu 및 Sn-3.0Ag-0.5Cu 합금 조성의 결과와 비교, 분석하였다. 또한 Sn-0.3Ag-0.7Cu 조성의 용융 특성을 시차주사열량계(differential scanning calorimeter, DSC)로 측정하고, 인장시험을 통한 응력-변형률 곡선을 관찰하였다. 아울러 Sn-0.3Ag-0.7Cu 조성의 젖음 특성을 향상시키기 위해 halide의 함유량이 많은 플럭스(flux)를 적용하거나 Sn-0.3Ag-0.7Cu 조성에 0.2wt.%의 In을 첨가하여 그 젖음 특성의 개선 정도를 분석해 보았다. 그 결과 halide 함유량이 높은 플럭스를 사용한 경우보다 미량의 In을 첨가한 경우가 $230{\sim}240^{\circ}C$의 저온 영역에서 wettability의 향상에 보다 효과적임을 관찰할 수 있었다. In this paper, wetting and interfacial reaction properties for low Ag containing Sn-Ag-Cu Pb-free solder alloy, i.e., Sn-0.3Ag-0.7Cu were investigated and compared with those of Sn-1.0Ag-0.5Cu and Sn-3.0Ag-0.5Cu. Melting behavior and stress-strain curves of some Sn-xAg-xCu alloys were also measured using a differential scanning calorimeter(DSC) and a tensile test machine, respectively. In order to enhance insufficient wetting properties of Sn-0.3Ag-0.7Cu alloy, the improvement of wetting properties were analyzed by applying fluxes containing higher content of halide or indium adding of 0.2wt.% into the solder alloy. It was concluded that the small addition of indium is more effective for the improvement of wettability in low temperature range of $230{\sim}240^{\circ}C$ than applying flux containing higher content of halide.

부모 행복감 구성요인 도출의 탐색 연구

유아미 숭실대학교 영재교육연구소 2021 Global Creative Leader Vol.11 No.2

The purpose of this study was to redefine the concept of parental happiness and to identify the component factors from the perspective that parents were interacting with their children and supporting children's growth, development and at the same time, parents are developing on their own happiness. Therefore, the concept and component factors were derived by previous studies and literature related to parental happiness, and the content validity of the concept and component factors was verified by experts. The total number of experts who participated in this study was 12 with 9 professionals related to pedagogy and 3 parent education experts. The results of the study were as follows: First, parent happiness was defined as being a parent, parents have the necessary conditions for raising children, can maintain a good relationship with their families such as their children and spouses, and feel that they were growing up with developmental interaction with their children. Second, the components of parent happiness were divided into existence, relationship, and growth and sub-variables for each were derived. The sub-variables of the existing domain included health, economic power, sociocultural environment, and appearance identity. The sub-variables of the relationship domain consisted of child, spouse, and parent relationships, other relationships, and social support. Sub-variables of the growth domain consisted of efficacy, positive emotion, self-growth, independence, rest and leisure. 본 연구의 목적은 부모라는 존재로서 자녀의 성장발달을 지원하면서 자신도 발달하고 있다는 관점에서 부모 행복감의 개념을 재정의하고 구성요인을 밝히는 것이었다. 따라서 부모 행복감과 관련된 선행연구와 문헌을 고찰하여 개념과 구성요인을 도출하고, 전문가에 의해 개념과 구성요인에 대한 내용타당도 검증과정을 거쳤다. 본 연구에 참여한 전문가는 교육학 관련 교수 9명과 부모 교육전문가 3명으로 총 12명이었다. 연구결과에 의하면 첫째로 부모 행복감이란‘부모라는 존재로서 자녀양육에 필요한 조건을 갖추었고, 자녀, 배우자 등 가족과 원만한 관계를 유지할 수 있으며 자신도 자녀와 발달적 상호작용을 하며 성장해간다고 느끼는 것이다’라고 개념을 조작적으로 정의하였다. 둘째로 부모 행복감의 구성영역을 존재, 관계, 성장의 3가지로 구분하였으며 각 영역별 구성요인을 도출하였다. 존재영역에서는 건강, 경제력, 사회·문화적 환경, 외모 정체감을 구성요인으로, 관계영역에서는 자녀 관계, 배우자 관계, 부모 관계, 타인 관계, 사회적 지지를 구성요인으로, 성장영역에서는 효능감, 긍정적 정서, 자기성장, 자립성, 여유·여가를 구성요인으로 제시하였다.

Effect of Mn Addition on the Properties of Sn-Ag-Cu-In Quaternary Lead-free Solder Alloy (초)

유아미,김준기,이종현,김목순 대한금속ㆍ재료학회 2009 대한금속재료학회 학술대회 개요집 Vol.2009 No.-

Reaction Properties and Interfacial Intermetallics for Sn-xAg-0.5Cu Solders as a Function of Ag Content

이종현,유아미,김정한,김목순,강남현 대한금속·재료학회 2008 METALS AND MATERIALS International Vol.14 No.5

Wetting and interfacial reactions were investigated for Sn-xAg-0.5Cu alloys, in which the Ag content had a variation from x = 1.0 to x = 4.0. Differential scanning calorimetry (DSC) was used to investigate the range of the melting temperature and the solidification temperature by measuring the endothermic and the exothermic heat flow, respectively. Low Ag contents increased the melting temperature ranges and deteriorated the wetting properties such as zero cross time and wetting force measured at two seconds. The extent of undercooling increased and the thickness of intermetallic compounds (IMC) decreased as the Ag content decreased. As the Ag content decreased, the initial IMC thickness decreased due to the large undercooling and, during the solid aging at 170℃, the IMC growth slightly decelerated because of the small diffusion coefficient. For the application of good drop shock reliability, Sn-Ag-Cu solder of low Ag content should be beneficial due to the restraint of the IMC growth (Cu6Sn5 and Cu₃Sn) and of the coarse plate-like IMC (Ag₃Sn).

Sn-Ag-Cu-In-(Mn, Pd) 무연솔더의 솔더링성과 BGA 접합부 신뢰성

장재원,유아미,이종현,이창우,김준기,Jang, Jae-Won,Yu, A-Mi,Lee, Jong-Hyun,Lee, Chang-Woo,Kim, Jun-Ki 한국마이크로전자및패키징학회 2013 마이크로전자 및 패키징학회지 Vol.20 No.3

Sn-3.0Ag-0.5Cu 무연솔더에서 Ag 함량의 감소는 기계적 충격 신뢰성 향상에 도움이 되는 반면 솔더링성을 저하시키는 것으로 알려져 있다. 본 연구에서는 저 Ag함유 무연솔더의 솔더링성 향상을 위해 In을 첨가한 Sn-1.2Ag-0.7Cu-0.4In 4원계 조성과 여기에 미량의 Mn 및 Pd을 첨가한 무연솔더 조성에 대하여 솔더 젖음성을 평가하고, 보드 레벨 BGA 패키지의 열싸이클링 및 기계적 충격 신뢰성을 평가하였다. Sn-1.2Ag-0.7Cu 조성에 0.4 wt% In을 첨가한 합금의 젖음성은 Sn-3.0Ag-0.5Cu에 근접한 수준으로 향상되었으나, 패키지의 열싸이클링 신뢰성은 Sn-3.0Ag-0.5Cu에 미치지 못하는 것으로 나타났다. Sn-1.2Ag-0.7Cu-0.4In 조성에 0.03 wt% Pd의 첨가는 솔더 젖음성 및 패키지 신뢰성을 저하시킨 반면에 0.1 wt% Mn을 첨가한 합금은 특히 기계적 충격 신뢰성이 Sn-3.0Ag-0.5Cu는 물론 Sn-1.0Ag-0.5Cu보다도 우수한 수준으로 향상되었는데, 이는 Mn 첨가가 합금의 모듈러스를 감소시킨 데에 기인하는 것으로 생각된다. Although the lowering of Ag content in Sn-3.0Ag-0.5Cu is known to improve the mechanical shock reliability of the solder joint, it is also known to be detrimental to the solderbility. In this study, the quaternary alloying effect of In and the minor alloying effects of Mn and Pd on the solderability, thermal cycling and mechanical shock reliabilities of the low Ag content Sn-1.2Ag-0.7Cu solder were investigated using board-level BGA packages. The solderability of Sn-1.2Ag-0.7Cu-0.4In was proved to be comparable to that of Sn-3.0Ag-0.5Cu but its thermal cycling reliability was inferior to that of Sn-3.0Ag-0.5Cu. While the 0.03 wt% Pd addition to the Sn-1.2Ag-0.7Cu-0.4In decreased the solderability and reliabilities of solder joint, the 0.1 wt% Mn addition was proved to be beneficial especially for the mechanical shock reliability compared to those of Sn-3.0Ag-0.5Cu and Sn-1.0Ag-0.5Cu compositions. It was considered to be due that the Mn addition decreased the Young's modulus of low Ag content Pb-free solders.

한의학적 슬통 평가 척도 개발 및 타당성 평가

이은솔,오지윤,유아미,이은용,김은정,이승덕,김갑성 대한침구의학회 2013 대한침구의학회지 Vol.30 No.5

Objjectives : This study is performed to develop the oriental medical rating scale of knee painand to assess its validity. Methods : 250 knee pain patients completed the previously accepted rating scale of kneepain(VAS, WOMAC(pain, function, stiffness), 6 minute walk test(number of steps, distance)) andoriental medical rating scale of knee pain which was developed by Hwang et al at 2012,before and after the 6 weeks acupuncture treatment. Comparing these results, we assessedthe validity of oriental medical rating scale. Results : Comparing oriental medical rating scale of knee pain before acupuncture treatmentwith VAS, WOMAC(pain, function, stiffness) and 6 minute walk test(number of steps, distance),oriental medical rating scale showed correlation with VAS, WOMAC(pain, function, stiffness)and showed the highest correlation with WOMAC(function). Comparing the change of orientalmedical rating scale of knee pain after 6 weeks of acupuncture treatment with the change ofVAS, WOMAC(pain, function, stiffness) and 6 minute walk test(number of steps, distance) after6 weeks, change of oriental medical rating scale showed correlation with the change of VAS,WOMAC(pain, function, stiffness) and showed the highest correlation with the change ofWOMAC(function). Through factor analysis of oriental medical rating scale items, 4 factors(pain,swelling, deformation of the knee, thermal sense of the knee), 17 items were extracted. Conclusions : Oriental medical rating scale of knee pain reflected the patient’s pain, functionallimitation and stiffness well. And oriental medical rating scale reflected the patient’s functionalimprovement after the treatment well.