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온도장 가시화를 위한 연성회로기판을 이용한 온도센서 어레이 제작 및 성능평가
안철희,김형훈,차제명,권봉현,하만영,박상후,정지환,김귀순,조종래,손창민,이정호,고정상 한국가시화정보학회 2009 한국가시화정보학회지 Vol.7 No.2
This paper presents the fabrication and performance measurement of a temperature sensor array on a flexible substrate attachable to a curved surface using MEMS technology. Specifically, the fabrication uses the well-developed printed circuit board fabrication technology for complex electrode definition. The temperature sensor array are lifted off with a 10×10 matrix in a 50×50 mm to visualize temperature distribution. Copper is used as temperature sensing material to measure the change in resistances with temperature increase. In a thermal oven with temperature control, the temperature sensor array is characterized. The constant slope of resistance change is obtained and temperature distribution is measured from the relationship between resistance and temperature. This paper presents the fabrication and performance measurement of a temperature sensor array on a flexible substrate attachable to a curved surface using MEMS technology. Specifically, the fabrication uses the well-developed printed circuit board fabrication technology for complex electrode definition. The temperature sensor array are lifted off with a 10×10 matrix in a 50×50 mm to visualize temperature distribution. Copper is used as temperature sensing material to measure the change in resistances with temperature increase. In a thermal oven with temperature control, the temperature sensor array is characterized. The constant slope of resistance change is obtained and temperature distribution is measured from the relationship between resistance and temperature.
곡면 유리 표면 위에서 박막 측온저항체 온도센서 어레이 제작 및 성능 평가
안철희(Chul Hee Ahn),김형훈(Hyoung Hoon Kim),박상후(Sang Hu Park),손창민(Changmin Son),고정상(Jeung Sang Go) 한국가시화정보학회 2011 한국가시화정보학회지 Vol.9 No.2
This paper presents a novel direct fabrication method of the thin metal film RTD temperature sensor array on an arbitrary curved surface by using MEMS technology to measure a distributed temperature field up to 300 ℃ without disturhing a fluid flow. In order to overcome the difficulty in the three dimensional photography or sensor patterning, the UV pre-irradiated photosensitive dry film resist technology has been developed newly. This method was applied to the fabrication of the temperature sensor array on a glass tube, which is arranged parallel and transverse to a main flow. Gold was used as a temperature sensing material. The resistance change was measured in a thermally controlled oven by increasing the environmental temperature. The linear increase in resistance change and a constant slope were obtained. Also, the sensitivity of each RTD temperature sensor was evaluated.
온도장 가시화를 위한 연성회로기판을 이용한 온도센서 어레이 제작 및 성능평가
안철희(Cheol Hee Ahn),김형훈(Hyung Hoon Kim),차제명(Je Myung Cha),권봉현(Bong Hyun Kwon),하만영(Man Yeong Ha),박상후(Sang Hu Park),정지환(Ji Hwan Jeong),김귀순(Kui Soon Kim),조종래(Jong Rae Cho),손창민(Chang Min Son),이정호(Jung Ho L 한국가시화정보학회 2010 한국가시화정보학회지 Vol.7 No.2
This paper presents the fabrication and performance measurement of a temperature sensor array on a flexible substrate attachable to a curved surface using MEMS technology. Specifically, the fabrication uses the well-developed printed circuit board fabrication technology for complex electrode definition. The temperature sensor array are lifted off with a 10×10 matrix in a 50 ㎜×50 ㎜ to visualize temperature distribution. Copper is used as temperature sensing material to measure the change in resistances with temperature increase. In a thermal oven with temperature control, the temperature sensor array is characterized. The constant slope of resistance change is obtained and temperature distribution is measured from the relationship between resistance and temperature.