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Ge-MOSFETs을 위한 Ni-Co 합금을 이용한 Ni-germanide의 열안정성 개선
박기영,정순연,장잉이,한인식,이세광,종준,신홍식,김영철,김재준,이가원,왕진석,이희덕,Park, Kee-Young,Jung, Soon-Yen,Zhang, Ying-Ying,Han, In-Shik,Li, Shi-Guang,Zhong, Zhun,Shin, Hong-Sik,Kim, Yeong-Cheol,Kim, Jae-Jun,Lee, Ga-Won,Wang, Jin 한국전기전자재료학회 2008 전기전자재료학회논문지 Vol.21 No.8
In this paper, Ni-Co alloy was used to improve thermal stability of Ni Germanide. It was found that uniform germanide is obtained on epitaxial Ge-on-Si substrate by employing Ni-Co alloy. Moreover, neither agglomeration nor penetration is observed during post-germanidation annealing process. The thermal stability of Ni germanide using Ni-Co alloy is improved due to the less agglomeration of Germanide. Therefore, the proposed Ni-Co alloy is promising for highly thermal immune Ni germanide for nano scale Ge-MOSFETs technology.
소아의 영양 평가 - 소아 신체계측과 생화학적 지표의 특성을 중심으로
박기영,Park, Kie Young 대한소아소화기영양학회 2009 Pediatric gastroenterology, hepatology & nutrition Vol.12 No.suppl1
Nutritional assessment is based on anthropometric, clinical, dietary and biochemical data. There is a lack of studies about the propriety of biochemical indexes for the nutritional assessment in children despite biochemical data in pediatric population are different from them in adult's in many respects. Serum albumin is useful index to evaluate the severity of malnutrition. Hemoglobin and hematocrit tend to decrease in malnutrition on account of defect of iron metabolism and to increase in metabolic syndrome on account of enhancement of erythropoiesis. But, unlike adult, total lymphocyte count is not so useful biochemical indexes in children. We should consider pediatric characteristic when interpret biochemical indexes for nutritional assessment in children, and nutritional status in children should be assessed comprehensively with anthropometric, clinical, dietary and biochemical data.
나노급 CMOSFET을 위한 니켈-코발트 합금을 이용한 니켈-실리사이드의 열안정성 개선
박기영,정순연,한인식,장잉잉,종준,이세광,이가원,왕진석,이희덕,Park, Kee-Young,Jung, Soon-Yen,Han, In-Shik,Zhang, Ying-Ying,Zhong, Zhun,Li, Shi-Guang,Lee, Ga-Won,Wang, Jin-Suk,Lee, Hi-Deok 한국전기전자재료학회 2008 전기전자재료학회논문지 Vol.21 No.1
In this paper, the Ni-Co alloy was used for thermal stability estimation comparison with Ni structure. The proposed Ni/Ni-Co structure exhibited wider range of rapid thermal process windows, lower sheet resistance in spite of high temperature annealing up to $700^{\circ}C$ for 30 min, more uniform interface via FE-SEM analysis, NiSi phase peak. Therefore, The proposed Ni/Ni-Co structure is highly promising for highly thermal immune Ni-silicide for nano-scale MOSFET technology.