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길사근,노승훈,신윤호,김영조,김건형 한국반도체디스플레이기술학회 2017 반도체디스플레이기술학회지 Vol.16 No.1
One of the most critical aspects of the modern semiconductor industry is the quality of wafer surface, the roughness of which is mostly caused by the ingot slicing. And the grinding is supposed to be the main process to reduce the surface roughness. The vibrations of the disc surface grinder are the major problem to effectively achieve the required surface quality. In this study, the structure of a disc surface grinder was analyzed through the experiment and the computer simulation to investigate the dynamic characteristics of the machine, and further to alter the design for the improved stability. The result of the study shows that simple design alterations without alternating main body can effectively suppress the vibrations of the machine.
가공정도 향상을 위한 Pipe Cutting Machine의 설계 개선
길사근,노승훈,신호범,김영조,김동욱,노호철 한국반도체디스플레이기술학회 2018 반도체디스플레이기술학회지 Vol.17 No.3
The modern industry requires the precision machining as well as the high productivity. The machine tool structure should be evaluated in aspects such as durability, static stability, precision rate and the dynamic stability which is one of the most critical characteristics in determining the magnitude of vibrations. In this study, the dynamic properties of a pipe cutting machine were investigated to analyze the structural vibrations of the machine, and further to improve the structural stability and precision machining. Frequency response test and computer simulation have been utilized for the analysis and the design alterations. And the result shows that proposed design alterations can reduce the vibrations of the machine substantially.
가공품질 향상을 위한 스마트폰 커버용 Machining Center Jig의 설계 개선
윤현진,이일환,한대성,길사근,김영조 한국반도체디스플레이기술학회 2019 반도체디스플레이기술학회지 Vol.18 No.4
One of the most critical aspects of the smartphone industry is the quality of the cover. And the vibrations of machining center are supposed to be the most dominant factors to damage the cover quality. In this study, structure of a machining center has been analyzed through experiments and computer simulations to figure out the main reasons of the vibrations. And the design alterations based on the analysis were applied to identify the effects of those alterations on the vibration suppression. The result shows that the design alterations can effectively suppress about 90% of the vibrations.
태양전지 웨이퍼용 Wire Saw안정화를 위한 지지구조 개선
이일환,노승훈,김동욱,박인규,길사근,김영조 한국반도체디스플레이기술학회 2018 반도체디스플레이기술학회지 Vol.17 No.3
In recent years, the solar cell market has steadily grown with the demand for new energies. And wire sawing is one of the most critical processes in manufacturing solar cell wafer which is supposed to affect the breakage of wafers most during the process and afterwards. Generally, the defects of the wafers are generated from the structural vibrations of the machine. In the sawing process, the vibrations cause unnecessary normal stress on the cut surface of wafers, and eventually create the surface damage or leave the residual stress. In this study, the dynamic properties of a wire saw have been analyzed through the frequency response test and the computer simulation. And the effects of the design alterations have been investigated to stabilize the machine structure and further to reduce the vibrations. The result shows that relatively simple design alterations of supporting structure without any change of major parts of the machine can suppress the vibrations of the machine effectively.
반도체 Wafer용 Edge Grinding Machine의구조 안정화를 위한 설계 개선
박유라,노승훈,김영조,길사근,김건형,신윤호 한국반도체디스플레이기술학회 2016 반도체디스플레이기술학회지 Vol.15 No.1
It is generally accepted that the surface quality of wafer edge is mostly damaged by the vibrations of the edge grinding machine. The surface quality of wafer edge is supposed to be the most dominant factor of the cracks, scratches, burrs and chips on the edge surfaces, which are the main defects of the wafers. In this study, the structure of a wafer edge grinder has been investigated through the frequency response experiment and the computer simulation to find ways to suppress the vibrations from the structure. The main reasons of the structural vibrations were analyzed. And further the design alterations were deduced from the results of the experiment and the simulation, and applied to the machine to check the effects of those alterations and to eventually improve the structural stability. The result shows that the machine can have much improved stability with relatively simple design changes.
Solar cell wafer용 squaring & grinding machine의 진동 억제를 위한 설계 변경
신호범,노승훈,윤현진,길사근,김영조,김건형,한대성 한국반도체디스플레이기술학회 2017 반도체디스플레이기술학회지 Vol.16 No.3
Solar cell industry requires high technologies to stabilize apparatuses for the wafer manufacturing. Vibrations of squaring & grinding machines are one of the most critical factors for causing residual stresses of ingots, which are the main reasons of the breakage in the following processes such as wire sawing, cleaning, and modularity. In this study, the structure of a squaring & grinding machine has been analyzed through experiments and computer simulations to figure out the ways to suppress the vibrations effectively, and further to minimize the breakage of wafers. The result shows that simple design changes of applying a few ribs can improve the stability of the machine.
단선억제 및 가공정도 향상을 위한 Draw Tower의 구조 안정화 설계
남규동,노승훈,윤현진,김영조,길사근,이대웅 한국반도체디스플레이기술학회 2019 반도체디스플레이기술학회지 Vol.18 No.2
Wire breakage in drawing, which is the most critical process in glass fiber manufacturing, is caused by numerous factors such as height, drawing speed, and air flow. The vibrations of the draw tower, however, is the most dominant factor to create the wire breakage. In this study, the structure of a draw tower has been analyzed through experiments and computer simulations to figure out the main reasons of the vibrations. And the design alterations were applied to the machine to identify the effects of those alterations. The result shows that design alterations of the draw tower structure can suppress the 87% of the vibrations, and further can prevent the wire breakage.
이일환,노승훈,한대성,김영조,길사근,박인규 한국반도체디스플레이기술학회 2019 반도체디스플레이기술학회지 Vol.18 No.1
Pipes are widely used in various industries such as automobile, anti-vibration devices, factories and ship building. Chamfering is one of the most critical processes in pipe manufacturing which removes burrs of the pipes for better surface quality. In most cases, the defects of the chamfered surface are originated from the structural vibrations of the chamfering machine. In this study, the dynamic characteristics of a chamfering machine have been analyzed though the experiment and the computer simulation. And the effects of the design parameters affecting the stability of the machine have been investigated to stabilize the machine structure and further to reduce structural vibrations. The result shows that design alterations to stabilize the machine can suppress the defects of the machined surface as well as the vibrations during chamfering.
구조 안정성 향상을 위한 Wafer Grinder의 설계 개선
신윤호,노승훈,윤현진,길사근,김영조,이대웅,김상화 한국반도체디스플레이기술학회 2019 반도체디스플레이기술학회지 Vol.18 No.3
One of the most critical aspects of the semiconductor industry is the quality of the wafer surface. And the vibrations of wafer grinder are supposed to be the most dominant factors to damage the wafer surface quality. In this study, structure of a wafer grinder has been analyzed through experiments and computer simulations to figure out the main reasons of the vibrations. And the design alterations based on the analysis were applied to identify the effects of those alterations on the vibration suppression. The result shows that the design alterations can effectively suppress about 90% of the vibrations.
신윤호,노승훈,김영조,이대웅,김상화,길사근,이일환 한국반도체디스플레이기술학회 2019 반도체디스플레이기술학회지 Vol.18 No.2
In this study, a hydraulic press structure has been investigated in order to enhance the precision machining and the productivity, which are generally damaged by the structural deformation from the pressure and the vibrations originated from the centrifugal forces from the rotating parts of the machine. Computer simulation based on the finite element method has been utilized for the analysis of static and dynamic characteristics to investigate each component`s critical points, and to further improve the static and dynamic stabilities of a hydraulic press structure. The result shows that the deformations and the vibrations of the machine could be reduced 35% without increasing the weight of the machine.