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EV / HEV 에서 사용되는 고전력 IGBT 모듈을 위한 소형 액체 냉각 시스템
기석간(Seokkan Ki),이주영(Jooyoung Lee),류승걸(Seunggeol Ryu),남영석(Youngsuk Nam) 대한기계학회 2017 대한기계학회 춘추학술대회 Vol.2017 No.11
In this work, we suggest a compact liquid cooling system based on a copper foam heat sink for thermal management of high power IGBT modules. Coolant path was designed for decreasing the pressure drop and effectively transferring the heat from heat sources. Cooling performance of the system was numerically evaluated with a commercial CFD software. We assumed a high power IGBT module for the condition of heat dissipation. We show that our liquid cooling system has a lower junction to coolant thermal resistance than previous cooling systems. Especially, low mass flow rate and pressure drop of the cooling loop was measured due to minimized coolant path and high porosity of the Cu foam. Numerical data was experimentally demonstrated with a given mass flow rate range. This study will be applied to high powered electronic applications where thermal management of multiple heat sources was needed.
핀 구조와 다공성 금속을 결합한 고집적 수냉식 IGBT 냉각 모듈의 성능 향상에 관한 연구
이주영(Jooyoung Lee),기석간(Seokkan Ki),남영석(Youngsuk Nam) 대한기계학회 2018 대한기계학회 춘추학술대회 Vol.2018 No.12
In this study, we propose an effective thermal management solution for high energy density IGBT module. We designed a fin-porous hybrid structure which a cylindrical pin-fin structure that connected to the bottom of the heat sink is directly inserted into the porous layer. When using this hybrid structure, the average temperature of heat sources decreased compared to the case of using only porous metal, and the temperature difference between each junction was kept very uniformly. In order to identify the cause of this performance improvement, we compared the conduction heat flux for the expanded heat exchange area. As a result, the conduction heat flux value in the pin structure under the heat source of the hybrid module was about 2.5 times higher than that in the case of using only the porous metal, and the convective heat flux decreased by only 15%. Based on this, we calculated the thermal resistance in the hybrid module, and consequently, we obtained a very low thermal resistance value of 0.18 K/W.