일체형 스마트 LED Driver ICs 패키지의 열 특성 분석

강이구,Kang, Ey Goo 한국전기전자재료학회 2016 전기전자재료학회논문지 Vol.29 No.2

This research was analyzed thermal characteristics that was appointed disadvantage when smart LED driver ICs was packaged and we applied extracted thermal characteristics for optimal layout design. We confirmed reliability of smart LED driver ICs package without additional heat sink. If the package is not heat sink, we are possible to minimize package. For extracting thermal loss due to overshoot current, we increased driver current by two and three times. As a result of experiment, we obtained 22 mW and 49.5 mW thermal loss. And we obtained optimal data of 350 mA driver current. It is important to distance between power MOSFET and driver ICs. If thhe distance was increased, the temperature of package was decreased. And so we obtained optimal data of 3.7 mm distance between power MOSFET and driver ICs. Finally, we fabricated real package and we analyzed the electrical characteristics. We obtained constant 35 V output voltage and 80% efficiency.

고내압 특성을 위한 진성영역과 트렌치 구조를 갖는 베이스 저항 사이리스터

강이구,성만영 한국전기전자재료학회 2002 전기전자재료학회논문지 Vol.15 No.3

In this paper, we haute proposed a novel trench electrode Base Resistance Thyristor(BRT) and trench electrode BRT with a intrinsic region. New power BRTs have shown superior electrical characteristics including the snab-back effect and the forward blocking voltage more than the conventional BRT. Especially, the trench electrode BRT with the intrinsic region has obtained high blocking voltage of 1600V. The blocking voltage of conventional BRT is about 400V at the same size. Because the breakdown mechanism of the BRT is the avalanch breakdown by impact ionization, the trench electrode BRT with intrinsic region has suppressed impact ionization, effectively. If we use this principle, we can develop a super high voltage power device and it applies to another power device including IGBT, EST and etc.

설계 및 공정 파라미터에 따른 3.3 kV급 Super Junction FS-IGBT에 관한 연구

강이구,Kang, Ey Goo 한국전기전자재료학회 2017 전기전자재료학회논문지 Vol.30 No.4

In this paper, we analyzed the structural design and electrical characteristics of a 3.3 kV super junction FS IGBT as a next generation power device. The device parameters were extracted by design and process simulation. To obtain optimal breakdown voltage, we researched the breakdown characteristics. Initially, we confirmed that the breakdown voltage decreased as trench depth increased. We analyzed the breakdown voltage according to p pillar dose. As a result of the experiment, we confirmed that the breakdown voltage increased as p pillar dose increased. To obtain more than 3.3 kV, the p pillar dose was $5{\times}10^{13}cm^{-2}$, and the epi layer resistance was $140{\Omega}$. We extracted design and process parameters considering the on state voltage drop.

Lateral IGBT의 기술과 동향

강이구 한국전기전자재료학회 2002 전기전자재료 Vol.15 No.3

GaN Power FET 모델링에 관한 연구

강이구,정헌석,김범준,이용훈,Kang, Ey-Goo,Chung, Hun-Suk,Kim, Beum-Jun,Lee, Young-Hun 한국전기전자재료학회 2009 전기전자재료학회논문지 Vol.22 No.12

In this paper, we proposed GaN trench Static Induction Transistor(SIT). Because The compound semiconductor had superior thermal characteristics, GaN and SiC power devices is next generation power semiconductor devices. We carried out modeling of GaN SIT with 2-D device and process simulator. As a result of modeling, we obtained 340 V breakdown voltage. The channel thickness was 3 urn and the channel doping concentration is $1e17\;cm^{-3}$. And we carried out thermal characteristics, too.

인텔리전트 파워 IC 기술의 동향

강이구,성만영 한국전기전자재료학회 2002 전기전자재료 Vol.15 No.3

고전압 Non Punch Through IGBT 및 Field Stop IGBT 최적화 설계에 관한 연구

강이구,Kang, Ey Goo 한국전기전자재료학회 2017 전기전자재료학회논문지 Vol.30 No.4

An IGBT (insulated gate bipolar transistor) device has an excellent current-conducting capability. It has been widely employed as a switching device to use in power supplies, converters, solar inverters, and household appliances or the like, designed to handle high power. The aim with IGBT is to meet the requirements for use in ideal power semiconductor devices with a high breakdown voltage, an on-state voltage drop, a high switching speed, and high reliability for power-device applications. In general, the concentration of the drift region decreases when the breakdown voltage increases, but the on-resistance and other characteristics should be reduced to improve the breakdown voltage and on-state voltage drop characteristics by optimizing the design and structure changes. In this paper, using the T-CAD, we designed the NPT-IGBT (non punch-through IGBT) and FS-IGBT (field stop IGBT) and analyzed the electrical characteristics of those devices. Our analysis of the electrical characteristics showed that the FS-IGBT was superior to the NPT-IGBT in terms of the on-state voltage drop.

설계 및 공정 변수에 따른 600 V급 IGBT의 전기적 특성 분석

강이구,Kang, Ey Goo 한국전기전자재료학회 2016 전기전자재료학회논문지 Vol.29 No.5

In this paper, we analyzed the electrical characteristics of NPT planar and trench gate IGBT after designing these devices according to design and process parameter. To begin with, we have designed NPT planar gate IGBT and carried out simulation with T-CAD. Therefore, we extracted design and process parameter and obtained optimal electrical characteristics. The breakdown voltage was 724 V and The on state voltage drop was 1.746 V. The next was carried out optimal design of trench gate power IGBT. We did this research by same drift thickness and resistivity of planar gate power IGBT. As a result of experiment, we obtain 720 V breakdown voltage, 1.32 V on state voltage drop and 4.077 V threshold voltage. These results were improved performance and fabrication of trench gate power IGBT and planar gate Power IGBT.

Super Junction MOSFET의 트렌치 식각 각도에 따른 열 특성 분석에 관한 연구

강이구,Kang, Ey Goo 한국전기전자학회 2014 전기전자학회논문지 Vol.18 No.4

본 논문에서는 Super Juction MOSFET의 우수한 열 특성을 검증하기 위해 도출된 공정 및 설계파라미터를 이용하여 열특성을 분석하였다. 열 특성 중 핵심공정인 Trench 식각 각도에 따른 온도차이, 열 저항, 그 때 흐르는 드레인 전류를 측정하여 전체 소비전력을 분석하였다. 분석한 결과 Trench 식각 각도가 $89.3^{\circ}$ 일 때 온도차와 열 저항 값이 가장 작게 나왔으며, 식각 각도에 따라서 분포는 경향성을 보이지 않았다. 따라서 반복 시뮬레이션과 실험을 통해 최적의 값을 도출해야 되며, 본 측정 결과 최적의 식각 각도는 $89.3^{\circ}$와 $89.6^{\circ}$의 결과를 보였다. 다른 전기적인 특성을 고려하여 최종 식각 각도를 보여야 하며, 열 특성의 우수한 SJ MOSFET이 산업에의 이용을 위해 본 논문의 자료가 충분히 활용할 수 있을 것으로 판단된다. This paper analyzed thermal characteristics of super junction MOSFET using process and design parameters. Trench process is very important to super junction MOSFET process. We analyzed the difference of temperature, thermal resistance, total power consumption according to trench etch angle. As a result we obtained minimum value of temperature difference and thermal resistance at $89.3^{\circ}$ of trench etch angle. The electrical characteristics distribution of super junction MOSFET is not showed tendency according to trench etch angle. We need iterative experiments and simulation for optimal value of electrical characteristics. The super junction power MOSFET that has superior thermal characteristics will use automobile and industry.

래치 업 특성의 개선과 고속 스위칭 특성을 위한 다중 게이트 구조의 새로운 LIGBT

강이구,성만영 한국전기전자재료학회 2000 전기전자재료학회논문지 Vol.13 No.5

In this paper a new conductivity modulated power transistor called the Lateral Insulated Gated Bipolar Transistor which included n+ ring and p-channel gate is presented. A new lateral IGBT structure is proposed to suppress latch-up and to improve turn off time by imploying n+ ring and p-channel gate and verified by MEDICI. The simulated I-V characteristics at $V_{G}$=15V show that the latch up occurs at $V_{A}$=18V and 6.9$\times$10$^{-5}$ A/${\mu}{\textrm}{m}$ for the proposed LIGBT while the conventional LIGBT latches at $V_{A}$=1.3V and 1.96${\mu}{\textrm}{m}$10$^{-5A}$${\mu}{\textrm}{m}$. It is shown that turn off characteristic of new LIGBT is 8 times than that of conventional LIGBT. And noble LIGBT is not n+ buffer layer because that It includes p channel gate and n+ ring. Therefore Mask for the buffer layer isn’t needed. The concentration of n+ ring is and the numbers of n+ ring and p channel gate are three for the optimal design.n.n.n.n.