Preparation and Thermoelectric Properties of Bi2Te2.7Se0.3 Nanocomposites

김일호,최순목,서원선,정동익 한국물리학회 2012 THE JOURNAL OF THE KOREAN PHYSICAL SOCIETY Vol.61 No.9

Cu- or Ag-dispersed Bi<SUB>2</SUB>Te<SUB>2.7</SUB>Se<SUB>0.3</SUB> nanocomposites were prepared by metal acetate decomposition and hot pressing. Cu or Ag nanoparticles were well-dispersed in the Bi<SUB>2</SUB>Te<SUB>2.7</SUB>Se<SUB>0.3</SUB> matrix, and thereby the power factor was greatly increased due to increase in the effective mass of a carrier. However, Cu or Ag dispersion did not affect the carrier concentration and could not reduce the lattice thermal conductivity because Cu or Ag nanoparticles did not act as phonon scattering centers effectively. Thermoelectric figure of merit was enhanced remarkably over wide temperature range of 323-523 K due to high power factor. Cu dispersion was much more effective to enhance the thermoelectric performance compared to Ag dispersion.

이종접합 쌍극자 트랜지스터(HBT)의 에미터 접촉층으로 사용되는 InGaAs에 대한 Pd/Ge/Ti/Pt의 오믹 접촉 특성

김일호,장경욱,박성호(주)가인테크 한국진공학회 2001 Applied Science and Convergence Technology Vol.10 No.2

N형 InGaAs에 대한 Pd/Ge/Ti/Pt 오믹 접촉 특성을 조사하였다. $450^{\circ}C$까지의 급속 열처리에 의해 우수한 오믹 특성을 나타내어 $400^{\circ}C$, 10초의 급속 열처리 조건에서 최저 $3.7\times10^{-6}\; \Omega\textrm{cm}^2$ 의 접촉 비저항을 나타내었다. 이는 열처리에 의해 생성된 Pd-Ge계 화합물의 형성 및 Ge의 InGaAs 표면으로의 확산과 관련이 있었다. 그러나 열처리 시간을 연장할 경우 접촉 비저항이 $low-10^5\; \Omega\textrm{cm}^2$로 약간 증가하였다. 고온 열처리 후에도 오믹 재료와 InGaAs의 평활한 계면을 유지하면서 우수한 오믹 특성을 나타내어, 화합물 반도체 소자의 오믹 접촉으로 충분히 응용 가능하다고 판단된다. Pd/Ge/Ti/Pt ohmic contact to n-type InCaAs was investigated. Minimum specific contact resistivity of $3.7\times10^{-6}\; \Omega\textrm{cm}^2$ was achieved by rapid thermal annealing at $400^{\circ}C$ for 10 seconds. This was related to the formation of Pd-Ge compounds and the in-diffusion of Ge atoms to InGaAs surface. However, the specific contact resistivity increased slightly to $low-10^5\; \Omega\textrm{cm}^2$ in the case of longer annealing time. Superior ohmic contact and non-spiking planar interface between ohmic materials and InGaAs were maintained after annealing at high temperature. Therefore, this thermally stable ohmic contact system is a promising candidate for compound semiconductor devices.

다임 추출물로 마리네이드한 염장고등어의 품질특성과 저장성 연구

김일호,김지응,강재희,Kim, Il Ho,Kim, Ji Eung,Kang, Jae-Hee 한국식품조리과학회 2012 한국식품조리과학회지 Vol.28 No.6

Although the mackerel is an excellent food, there are disadvantages of its own smell and its shelf-life. So this study aimed to examine the quality assessment, shelf-life and acceptability of mackerel marinated with different amounts of thyme extract through the salinity, pH, texture, change of color, and sensory evaluation for reducing the smell of it and improving the shelf-life and acceptability of it with the thyme of various physiologic activities. The salinity of mackerel marinated with different amounts of thyme was a lower 2% than that of the existing salted mackerel, 5%, when producing the salted mackerel in the experimental method of this study, reducing the intake of salt. The shelf life of the existing salted mackerel was up to 4 weeks, while that of the salted mackerel marinated with thyme extract was up to 5 weeks. The change in pH during storage showed that the salted mackerel marinated with thyme extract after 5 weeks were within the initial decomposition of dark-fleshed fishes, pH 6.2-6.4, which the shelf life was extended due to the preservative effect of antioxidant content. The acceptability test showed that T 1 marinated with 1% thyme extract was ideal in all flavor, taste and general acceptability.

AIGaAs/GaAs HBT 응용을 위한 Pd/Si/Ti/Pt 오믹 접촉

김일호,박성호(주)가인테크 한국진공학회 2001 Applied Science and Convergence Technology Vol.10 No.3

N형 InGaAs에 대한 Pd/Si/Ti/Pt 오믹 접촉 특성을 조사하였다. 증착 상태에서는 접촉 비저항을 측정할 수 없을 정도의 비오믹 특성을 보였으며, $375^{\circ}C$에서 10초 동안 열처리한 경우 $5\times10^{-3}\Omega\textrm{cm}^2$의 높은 접촉 비저항을 나타내었다. 그러나 열처리 시간을 60초로 연장할 경우 접촉 비저항이 $1.7\times10^{-6}\Omega\textrm{cm}^2$로 급격히 감소하였고, 열처리 조건을 $425^{\circ}C$, 10초로 변화시킬 경우 $2\times10^{-6}\Omega\textrm{cm}^2$의 접촉 비저항을 나타내었다. 또한 $450^{\circ}C$까지도 오믹 재료와 InGaAs의 평활한 계면을 유지하면서 우수한 오믹 특성을 나타내어, 화합물 반도체 소자의 오믹 접촉으로 충분히 응용가능하다. Pd/Si/Ti/Pt ohmic contact to n-type InGaAs was investigated. As-deposited contact showed non-ohmic behavior, and high specific contact resistivity of $5\times10^{-3}\Omega\textrm{cm}^2$ was achieved by rapid thermal annealing at $375^{\circ}C$ for 10 seconds. However, the specific contact resistivity decreased remarkably to $1.7\times10^{-6}\Omega\textrm{cm}^2$ and $2\times10^{-6}\Omega\textrm{cm}^2$ at $375^{\circ}C$/60sec and $425^{\circ}C$/10sec, respectively. Superior ohmic contact and non-spiking planar interface between ohmic materials and InGaAs were maintained even at $450^{\circ}C$, therefore, this thermally stable ohmic contact system is a promising candidate for compound semiconductor devices.

AlGaAs/GaAs HBT 에미터 전극용 Pd/Ge계 오믹 접촉

김일호,Kim, Il-Ho 한국재료학회 2003 한국재료학회지 Vol.13 No.7

Pd/Ge/Ti/Pt and Pd/Ge/Pd/Ti/Au ohmic contacts to n-type InGaAs were investigated for applications to AlGaAs/GaAs HBT emitter ohmic contacts. In the Pd/Ge/Ti/Pt ohmic contact minimum specific contact resistivity of $3.7${\times}$10^{-6}$ $\Omega$$\textrm{cm}^2$ was achieved by rapid thermal annealing at $^400{\circ}C$/10 sec. In the Pd/Ge/Ti/Au ohmic contact, minimum specific contact resistivity of $1.1${\times}$10^{-6}$ $\Omega$$\textrm{cm}^2$ was achieved by annealing at 40$0^{\circ}C$/10 sec but the ohmic performance was degraded with increasing annealing temperature due to the reaction between the ohmic contact materials and the InGaAs substrate. However, non-spiking planar interface and relatively good ohmic contact (high-$10^{-6}$ /$\Omega$$\textrm{cm}^2$) were maintained after annealing at $450^{\circ}C$/10 sec. Therefore, these thermally stable ohmic contact systems are promising candidates for compound semiconductor devices. RF performance of the AlGaAs/GaAs HBT was also examined by employing the Pd/Ge/Ti/Pt and Pd/Ge/Pd/Ti/Au systems as emitter ohmic contacts. Cutoff frequencies were 63.5 ㎓ and 65.0 ㎓, respectively, and maximum oscillation frequencies were 50.5 ㎓ and 51.3 ㎓, respectively, indicating very successful high frequency operations.

Skutterudite CoSb₃의 합성 및 열전특성

김일호,유신욱,박종범,이정일,어순철,장경욱,최국선,김준수,김현주,Kim I. H.,You S. W.,Park J. B.,Lee J. I.,Ur S. C.,Jang K. W.,Choi G. S.,Kim J. S.,Kim H. J. 한국재료학회 2005 한국재료학회지 Vol.15 No.10

Binary skutterudite $CoSb_3$ compounds were prepared by the arc melting and hot pressing processes and their thermoelectric properties were investigated in the range from 300 to 600 K. Annealing effect was correlated to phase transformation and homogenization. Thermoelectric properties of the arc-melted and hot-pressed $CoSb_3$ were discussed and compared. Undoped intrinsic $CoSb_3$ prepared by the arc melting showed p-type conduction, while it showed metallic behavior with increasing measuring temperature. However, hot pressed specimens showed n-type conduction, possibly due to Sb evaporation. Thermoelectric properties were remarkably improved by annealing In vacuum and they were closely related to phase transformation.

P형 Bi_0.5Sb_1.5Te₃ 박막의 열전 특성에 미치는 두께 및 어닐링 효과

김일호,장경욱,Kim Il-Ho,Jang Kyug-Wook 한국재료학회 2004 한국재료학회지 Vol.14 No.1

P-type $Bi_{0.5}$$Sb_{1.5}$ $Te_3$ thin films were deposited by the flash evaporation technique, and their thermoelectric properties and electronic transport parameters were investigated. The effective mean free path model was adopted to examine the thickness effect on the thermoelectric properties. Annealing effects on the carrier concentration and mobility were also studied, and their variations were analyzed in conjunction with the antisite defects. Seebeck coefficient and electrical resistivity versus inverse thickness showed a linear relationship, and the effective mean free path was found to be 3150$\AA$. No phase transformation and composition change were observed after annealing treatment, but carrier mobility increased due to grain growth. Carrier concentration decreased considerably due to reduction of the antisite defects, so that electrical conductivity decreased and Seebeck coefficient increased. When annealed at 473 K for 1 hr, Seebeck coefficient and electrical conductivity were $160\mu$V/K and 610 $W^{-1}$ $cm^{ -1}$, respectively. Therefore, the thermoelectric quality factor were also enhanced to be $16\mu$W/cm $K^2$.>.

호텔 종사원의 소진, 직무만족, 조직몰입 간의 구조관계 연구

김일호,김동준 한국호텔관광학회 2012 호텔관광연구 Vol.14 No.4

The purpose of this study is to examine the impacts of hotel employee burnout on job satisfaction and organizational commitment. Therefore, this study investigated the effects of emotional exhaustion, depersonalization and reduced accomplishment on job satisfaction and organizational commitment through a demonstrative analysis. The results of the practical analysis can be summarized as follows. First, as for the mutual relation between burnout and job satisfaction, the influence degree that emotional exhaustion and reduced accomplishment factors makes on job satisfaction shows positive influence. However, the factor of reduced accomplishment had not significant effect on job satisfaction. Second, in case of relationship between job satisfaction and organizational commitment, job satisfaction leads organizational commitment positively. They have to invest their resources more efficiently making changes to burnout to decrease the job satisfaction and organizational commitment.

AIGaAs/GaAs HBT 응용을 위한 Pd/Ge/Pd/Ti/Au 오믹 접촉

김일호,박성호(주)가인테크 한국진공학회 2002 Applied Science and Convergence Technology Vol.11 No.1

N형 InGaAs에 대한 Pd/Ge/Pd/Ti/Au 오믹 접촉의 급속 열처리 조건에 따른 오믹 특성을 조사하였다. $450^{\circ}C$까지의 열처리에 의해 우수한 오믹 특성을 나타내어 $400^{\circ}C$/10초의 급속 열처리 후에 최저 $1.1\times10^{-6}\Omega\textrm{cm}^2$의 접촉 비저항을 나타내었다. $425^{\circ}C$ 이상의 열처리 후에 접촉 비저항이 점점 증가하여 $450^{\circ}C$에서는 오믹 재료와 InGaAs의 반응에 의해 오믹 특성의 열화가 나타났다. 그러나 high-$10^{-6}\Omega\textrm{cm}^2$ 정도의 비교적 우수한 오믹 특성을 유지하였고, 양호한 표면 및 계면이 얻어져 화합물 반도체 소자에의 응용 가능성이 충분한 것으로 판단된다. Pd/Ge/Pd/Ti/Au ohmic contact to n-type InGaAs was investigated with rapid thermal annealing conditions. Minimum specific contact resistivity of $1.1\times10^{-6}\Omega\textrm{cm}^2$ was achieved after annealing at $400^{\circ}C$/10sec, and a ohmic performance was degraded at higher annealing temperature due to the chemical reaction between the ohmic contact materials and the InGaAs substrate. However, non-spiking planar interface and relatively good ohmic contact($high-10^{-6};{\Omega}\textrm{cm}^2$) were maintained. This ohmic contact system is expected to be a promising candidate for compound semiconductor devices.

AlGaAs/GaAs HBT 에미터 전극용 Pd/Si계 오믹 접촉

김일호 한국진공학회 2003 Applied Science and Convergence Technology Vol.12 No.4

AlGaAs/GaAs HBT 에미터 오믹 접촉을 위해 n형 InGaAs에 대한 Pd/Si/Ti/Pt 및 Pd/Si/Pd/Ti/Au 오믹 접촉 특성을 조사하였다. Pd/Si/Ti/Pt 오믹 접촉의 경우, 증착 상태에서는 접촉 비저항을 측정할 수 없을 정도의 비오믹 특성을 보였으며, $375^{\circ}C$에서 10초 동안 열처리한 경우 $5\times10^{-3}\Omega\textrm{cm}^2$의 높은 접촉 비저항을 나타내었다. 그러나 열처리 조건을 $425^{\circ}C$, 10초로 변화시킬 경우 $2\times10^{-6}\Omega\textrm{cm}^2$의 낮은 접촉 비저항을 나타내었다. Pd/Si/Pd/Ti/Au 오믹 접촉의 경우, $450^{\circ}C$까지의 열처리 동안에 전반적으로 우수한 오믹 특성을 나타내어 $400^{\circ}C$, 20초의 급속 열처리 조건에서 최저 $3.9\times10^{-7}\Omega\textrm{cm}^2$의 접촉 비저항을 나타내었다. 두 오믹 접촉 모두 오믹 재료와 InGaAs의 평활한 계면을 유지하면서 우수한 오믹 특성을 나타내어, 화합물 반도체 소자의 오믹 접촉으로 충분히 응용 가능하였다. Pd/Si/Ti/Pt 및 Pd/Si/Pd/Ti/Au를 AlGaAs/GaAs HBT의 에미터 오믹 접촉으로 사용하여 제작된 HBT 소자의 고주파 특성을 측정한 결과, 차단 주파수가 각각 63.9 ㎓ 및 74.4 ㎓로, 또한 최대공진 주파수가 각각 50.1 ㎓ 및 52.5 ㎓로 우수한 작동특성을 보였다. Pd/Si/Ti/Pt and Pd/Si/Pd/Ti/Au ohmic contacts to n-type InCaAs were investigated for applications to AlGaAs/GaAs HBT emitter ohmic contacts. In the Pd/Si/Ti/Pt ohmic contact, as-deposited contact showed non-ohmic behavior, and high specific contact resistivity of $5\times10^{-3}\Omega\textrm{cm}^2$ was achieved by rapid thermal annealing at $375^{\circ}C$/10 sec. However, the specific contact resistivity decreased remarkably to $2\times10^{-6}\Omega\textrm{cm}^2$ by annealing at $425^{\circ}C$/10sec. In the Pd/Si/Pd/Ti/Au ohmic contact, minimum specific contact resistivity of $3.9\times10^{-7}\Omega\textrm{cm}^2$ was achieved by annealing at $400^{\circ}C$/20sec. In both ohmic contacts, low contact resistivity and non-spiking planar interface between ohmic materials and InGaAs were maintained. Therefore, these thermally stable ohmic contact systems are promising candidates for compound semiconductor devices. RF performance of the AlGaAs/GaAs HBT was also examined by employing the Pd/Si/Ti/Pt and Pd/Si/Pd/Ti/Au systems as emitter ohmic contacts. Cutoff frequencies were 63.9 ㎓ and 74.4 ㎓, respectively, and maximum oscillation frequencies were 50.1 ㎓ and 52.5 ㎓, respectively. It shows very successful high frequency operations.