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Plasma Processing of Soft Materials for Development of Inorganic/Organic Hybrid Devices
Yuichi Setsuhara,Ken Cho,Kosuke Takenaka 한국표면공학회 2010 한국표면공학회 학술발표회 초록집 Vol.2010 No.11
Plasma generation and control technologies for development of inorganic/organic hybrid devices have been developed with multiple low-inductance antenna (LIA) modules, as a promising candidate of ultra-large-area and high-density plasma sources for next-generation processing of hybrid flexible devices. Properties of argon-oxygen mixture plasmas sustained with multiple LIA units have been investigated and surface modifications of polymer substrates using the plasmas have been carried out. Ion energy distribution at the sheath edge of the argon-oxygen mixture plasmas showed considerable suppression of ion energies as small as or less than 10 eV. Effects of plasma exposure on surface modification and/or degradation of polymers have been examined using hard x-ray photoelectron spectroscopy (HXPES) in terms of chemical bonding states of the polymer surface.
Deposition Profile Control of Carbon Films on the Surface of Fine Structures using Plasma CVD
Kzunori Koga,Takuya Nomura,Masaharu Shiratani,Yuichi Setsuhara,Makoto Sekine,Masaru Hori 한국표면공학회 2010 한국표면공학회 학술발표회 초록집 Vol.2010 No.11
Deposition profile of DLC and a-C:H films in trenches is one of the concerns to realize coatings on patterned substrates. We have succeeded in controlling deposition profile of Cu in trenches for nano-fabrications, and have realized sub-conformal, conformal and anisotropic deposition. We are applying the deposition profile control method to carbon films in trenches. Deposition rate increases with decreasing the substrate temperature, because carbon etching rate by H atoms decreases with decreasing the substrate temperature. Deposition rate on sidewall and that on bottom decrease with increasing aspect ratio, while deposition rate on top little depends on the aspect ratio. The results suggest that the deposition profile can be controlled by changing deposition condition.