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Design for a Dual-Frequency Antenna-in-Package
Li Li,Liping Han,Guorui Han,Xinwei Chen,Yanfeng Geng,Wenmei Zhang 한국전자통신연구원 2010 ETRI Journal Vol.32 No.4
For an antenna-in-package (AiP), via holes are used to connect the antenna ground and system ground. In this letter, a dual-frequency AiP with a U-slot embedded in the patch is proposed. By properly arranging three via holes under the non-radiating edge, an AiP with two resonant frequencies is realized. Then a U-slot is embedded in the patch to further improve the bandwidth of the AiP. To validate the proposed design, an AiP with the bandwidth of 4.49% at 2.45 GHz and 6.02% at 5.32 GHz is achieved and fabricated. The measured results agree with the simulated results.