http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
Hydrographic Model Test on Prevention against Vortex Occurrence for Vertical Bulb Turbine
Yamato, Shoichi,Nakamura, Shogo,Furukawa, Akinori Korean Society for Fluid machinery 2009 International journal of fluid machinery and syste Vol.2 No.4
A vertical bulb turbine unit with elbow type draft tube has been developed due to avoidance of complicated assembling and long standstill period at overhaul in comparison with conventional horizontal bulb turbine unit. Before designing the prototype vertical bulb unit, a hydrographic model test was carried out to establish the ideal design concept for this innovative generating unit. Froude similarity is not available for vortex occurrence. Consequently, an intake structure without air entraining vortices under all the flow conditions is developed, and it is confirmed that the surge wave at load rejection is not affected harmful influence for other constructions.
Thermal, Tribological, and Removal Rate Characteristics of Pad Conditioning in Copper CMP
Hyosang Lee,Darren DeNardis,Ara Philipossian,Yoshiyuki Seike,Mineo Takaoka,Keiji Miyachi,Shoichi Furukawa,Akio Terada,Yun Zhuang,Len Borucki 한국전기전자재료학회 2007 Transactions on Electrical and Electronic Material Vol.8 No.2
High Pressure Micro Jet (HPMJ) pad conditioning system was investigated as an alternative to diamond disc conditioning in copper CMP. A series of comparative 50-wafer marathon runs were conducted at constant wafer pressure and sliding velocity using Rohm & Haas IC1000 and Asahi-Kasei EMD Corporation (UNIPAD) concentrically grooved pads under ex-situ diamond conditioning or HPMJ conditioning. SEM images indicated that fibrous surface was restored using UNIPAD pads under both diamond and HPMJ conditioning. With IC1000 pads, asperities on the surface were significantly collapsed. This was believed to be due to differences in pad wear rates for the two conditioning methods. COF and removal rate were stable from wafer to wafer using both diamond and HPMJ conditioning when UNIPAD pads were used. Also, HPMJ conditioning showed higher COF and removal rate when compared to diamond conditioning for UNIPAD. On the other hand, COF and removal rates for IC1000 pads decreased significantly under HPMJ conditioning. Regardless of pad conditioning method adopted and the type of pad used, linear correlation was observed between temperature and COF, and removal rate and COF.
Thermal, Tribological, and Removal Rate Characteristics of Pad Conditioning in Copper CMP
Lee, Hyo-Sang,DeNardis, Darren,Philipossian, Ara,Seike, Yoshiyuki,Takaoka, Mineo,Miyachi, Keiji,Furukawa, Shoichi,Terada, Akio,Zhuang, Yun,Borucki, Len The Korean Institute of Electrical and Electronic 2007 Transactions on Electrical and Electronic Material Vol.8 No.2
High Pressure Micro Jet (HPMJ) pad conditioning system was investigated as an alternative to diamond disc conditioning in copper CMP. A series of comparative 50-wafer marathon runs were conducted at constant wafer pressure and sliding velocity using Rohm & Haas IC1000 and Asahi-Kasei EMD Corporation (UNIPAD) concentrically grooved pads under ex-situ diamond conditioning or HPMJ conditioning. SEM images indicated that fibrous surface was restored using UNIPAD pads under both diamond and HPMJ conditioning. With IC1000 pads, asperities on the surface were significantly collapsed. This was believed to be due to differences in pad wear rates for the two conditioning methods. COF and removal rate were stable from wafer to wafer using both diamond and HPMJ conditioning when UNIPAD pads were used. Also, HPMJ conditioning showed higher COF and removal rate when compared to diamond conditioning for UNIPAD. On the other hand, COF and removal rates for IC1000 pads decreased significantly under HPMJ conditioning. Regardless of pad conditioning method adopted and the type of pad used, linear correlation was observed between temperature and COF, and removal rate and COF.