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Xu Xu,Jinhong Yu,Zihai He,Shaorong Lu,Dong Guo 한국고분자학회 2014 Macromolecular Research Vol.22 No.10
A reactive compatibilizer containing flexible segment (RCFS) was synthesized and characterized by Fouriertransform infrared spectroscopy (FTIR) and gel permeation chromatography (GPC). The RCFS was used as acompatibilizer for the preparation of lignin/polypropylene (PP) wood plastic composites, and the effect of the RCFSon the properties of composites (e.g., mechanical properties, thermal properties, crystal structure, and morphology)were investigated in detail. Experimental results indicated that the lignin/PP composite displayed the best performancewith the addition of 2 wt% RCFS. Its impact strength, flexural strength, and modulus were 56.8%, 37.3%,and 20.6%, respectively, which are higher than those of the untreated composites. Moreover, RCFS treatment couldalso increase the thermal stability, crystallization rate, and degree of crystallinity of lignin/PP composites.
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Zhengkai Yuan,Jinhong Yu,Baolin Rao,Hua Bai,Nan Jiang,Jian Gao,Shaorong Lu 한국고분자학회 2014 Macromolecular Research Vol.22 No.4
In this report, we demonstrate that the thermal conductivity, glass transition temperature, thermal stabilityand dynamical mechanical properties of epoxy composites could all be improved by incorporating hyperbranchedaromatic polyamide grafted silicon carbide (SiC-HBP) whiskers, using a solution method. The morphology andthermal properties of these newly modified epoxy composites were systematically analyzed and studied. Fouriertransform infrared spectroscopy (FTIR), nuclear magnetic resonance spectroscopy (NMR), and thermal gravimetricanalyses (TGA) proved hyperbranched aromatic polyamide grafted SiC whiskers were successfully prepared bysolution polymerization. The thermal conductivity of epoxy composite with 30 wt% of SiC-HBP had 2-fold improvement,compared to that of the neat epoxy. Besides, the glass transition temperatures (Tg) and dynamical mechanicalproperties of the epoxy composites were also raised by the addition of SiC-HBP, which indicates strong interfacialadhesion between SiC-HBP and the epoxy matrix. Most importantly, the incorporation of SiC-HBP in the epoxymatrix could effectively improve the thermal stability of the epoxy composites, according to our thermogravimetricanalysis (TGA).
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