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Sn-3.0Ag-0.5Cu 솔더재료의 크립-피로 균열진전에 대한 연구
우태욱(Tae Wuk Woo),Masao Sakane,Kaoru Kobayashi,박현철(Hyun Chul Park) 대한기계학회 2009 대한기계학회 춘추학술대회 Vol.2009 No.11
This study investigates crack growth behavior of Sn-3.0Ag-0.5Cu lead-free solder under creep-fatigue conditions. Crack growth tests were conducted using center-cracked-plate specimens in slow-fast (cp), fastslow (pc) and slow-slow (cc) strain waveforms with nominal strain control. The crack growth rates for the three strain waveforms were correlated with the creep J-integral range.
Microstructural Study of Creep-Fatigue Crack Propagation for Sn-3.0Ag-0.5Cu Lead-Free Solder
Woo, Tae-Wuk,Sakane, Masao,Kobayashi, Kaoru,Park, Hyun-Chul,Kim, Kwang-Soo The Korean Microelectronics and Packaging Society 2010 마이크로전자 및 패키징학회지 Vol.17 No.3
Crack propagation mechanisms of Sn-3.0Ag-0.5Cu solder were studied in strain controlled push-pull creepfatigue conditions using the fast-fast (pp) and the slow-fast (cp) strain waveforms at 313 K. Transgranular cracking was found in the pp strain waveform which led to the cycle-dominant crack propagation and intergranular cracking in the cp strain waveform that led to the time-dominant crack propagation. The time-dominant crack propagation rate was faster than the cycle-dominant crack propagation rate when compared with J-integral range which resulted from the creep damage at the crack tip in the cp strain waveform. Clear recrystallization around the crack was found in the pp and the cp strain waveforms, but the recrystallized grain size in the cp strain waveform was smaller than that in the pp strain waveform. The cycle-dominant crack propagated in the normal direction to the specimen axis macroscopically, but the time-dominant crack propagated in the shear direction which was discussed in relation with shear micro cracks formed at the crack tip.
Sn-3.0Ag-0.5Cu 솔더재료의 피로 균열진전에 관한 연구
우태욱(Tae Wuk Woo),김광수(Kwang Soo Kim),Masao Sakane,Kaoru Kobayashi 대한기계학회 2008 대한기계학회 춘추학술대회 Vol.2008 No.11
This study investigates crack propagation behavior of Sn-3.0Ag-0.5Cu solder under pull-push loading conditions. Fatigue Crack Growth (FCG) tests were conducted on Center Cracked Plate (CCP) specimens in fast-fast (pp) strain waveform. The fast-slow (pc), slow-fast (cp) and slow-slow (cc) strain waveforms were also used to study the effect of strain rates. The crack propagation rates for the four strain waveforms were correlated with J-integral range and a scatter band of factor 4 was found. The crack growth rates for the pc waveform was highest, followed by cp, cc and then pp waveforms.