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The Advanced 7<SUP>th</SUP> Generation IGBT Module for High Power Density Technology
J. Kawabata,Y. Kusunoki,Y. Onozawa,Y. Nishimura,Y. Kobayashi,O. Ikawa 전력전자학회 2015 ICPE(ISPE)논문집 Vol.2015 No.6
Recently the main requirements found in the market are further downsizing and higher efficiency of power conversion systems. Enhanced power density of the power modules will be the key to succeed. The increasing package reliability in higher junction temperature operation will be the major challenge. By further improvement of the chip characteristics and the development of new high reliability package materials and technologies, the performance of the modules were significantly improved. Additionally, the maximum operating temperature was even increased to up to 175°C. The new 7<SUP>th</SUP> generation IGBT module realized further downsizing and higher efficiency of power conversion systems.