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Trace Metals Optimization in Ceria Abrasive for Material Removal Rate Enhancement during ILD CMP
Shin, Cheolmin,Choi, Jinhak,Kim, Hojoong,Kulkarni, Atul,Kwak, Donggeon,Kim, Eungchul,Kim, Taesung The Electrochemical Society 2017 ECS journal of solid state science and technology Vol.6 No.10
<P>Ceria abrasive has been widely used in chemical mechanical planarization (CMP) to achieve a high material removal rate. To achieve optimum CMP performance, Ce<SUP>3+</SUP> ions need to be generated on the ceria particle surface so they can react with SiO<SUB>2</SUB>. Based on the redox reaction, trace metals can be good candidates for forming the required ions. In this study, FeCl<SUB>2</SUB> and CrCl<SUB>2</SUB> trace metals with ceria were evaluated in terms of their CMP performance and effectiveness. The role of oxygen vacancies formed on the ceria surface using trace metals was experimentally investigated. Compared to FeCl<SUB>2</SUB>, CrCl<SUB>2</SUB> exhibits better CMP performance. We observed that with the addition of CrCl<SUB>2</SUB> trace metals in the ceria abrasive, the removal rate of SiO<SUB>2</SUB> was enhanced by 1.3 times that of only ceria abrasive. Further, in the presence of CrCl<SUB>2</SUB>, the SiO<SUB>2</SUB> wafer surface roughness was reduced from 0.473 nm to 0.390 nm.</P>
Shin, Cheolmin,Chung, Hyunjae,Kim, Eungchul,Hong, Seokjun,Kwak, Donggeon,Jin, Yinhua,Kulkarni, Atul,Kim, Taesung The Electrochemical Society 2018 ECS journal of solid state science and technology Vol.7 No.2
<P>The porous polyurethane polishing pads are extensively used in the chemical mechanical polishing. The pad property is very important and influences the polishing effectiveness and the wafer surface quality. Hence, in the present work, the physicochemical degradation of unused polyurethane polishing pads during metal chemical mechanical polishing (CMP) in the presence of hydrogen peroxide (H2O2) was studied. It was found that the polishing pads were reacted chemically with H2O2 resulting in degradation of the polymer chain network of polishing pad and reduction in the pad elastic modulus. Pad polymer network chain scission was observed during FT-IR evaluation confirming the degradation of the pad. CMP experiments with the H2O2 soaked pads resulted in change in material removal rate (MRR) and the within-wafer non-uniformity (WIWNU). Further Pad elastic modulus estimated by colorimetric evaluation and CIE Lab color coordinates. (C) 2018 The Electrochemical Society.</P>
박종민(Jongmin Park),정세진(Sejin Jung),김응철(Eungchul Kim),이준권(Junkwon Lee),이진기(Jinkee Lee) 대한기계학회 2016 대한기계학회 춘추학술대회 Vol.2016 No.12
Hypochlorous acid(HOCl) with a concentration of 10~80ppm is edible and harmless as well as having high disinfection effect. HOCl solution is made by electrolysis of hydrochloric acid and diluted by water. If fish products are stored with ice which is containing HOCl, it will benefit to disinfection effect as well as long-term storage. In this paper, we optimized flow rate of hydrochloric acid and current value to be able to product HOCl solution which had optimum qualification of pH and residual chlorine with numerical analysis using ANOM Analysis and Neural Network. Furthermore, we analyzed efficiency of freezing HOCl solution in several ways by measuring properties of HOCl solution and confirmed that the way to freeze HOCl solution is efficient in terms of disinfection effect. As a result, the case of freezing sealed with a slid was more efficient than the case of freezing without sealing with a slid, but both two cases were more inefficient than the case of storage at room temperature with no-freezing. Also, the ice which was made by ice making machine contained a very small amount of HOCl and it was proved theoretically by aspect of change amount of Gibbs free energy when HOCl particles are adsorbed in ice surface.