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Applying Boolean logic algorithm for photomask pattern design
Wen-Hsing Kao,Bo-Shen Liou,Wen-Hsiang Shen,Yung-Lung Tsou 한국정보기술융합학회 2013 JoC Vol.4 No.2
The reason for the trend in high-level large-area photomasks is that mask size is becoming larger and the line size and gap design is becoming thinner. In addition, the uniformity requirements for producing photomasks are becoming stricter. Consequently, the difficulties faced in manufacturing photomasks have substantially increased and a particular graphic process is required to assist with improving the yield of photomask production. During the etching process of mask production, a non-uniform etching rate produces an inferior uniformity of the critical dimensions. The reasons for the inferior etching rate results include the uniformity of the photomask pattern, the spin speed of the etching machine, and the nozzle of the etching arms. This research focuses on the photomask pattern line-width compensation for improving uniformity and precision. The research combines logical operations to select the patterns that are necessary for special compensation, adding the appropriate compensation value to the pattern and combining it with the original pattern to generate a complete photomask pattern to compensate for the inferior etching rate that produces inferior line-width uniformity.
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