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RISS 인기검색어
- 검색키워드
- 저자 : Amir Sajjad Bahman (검색결과 2 건)
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A Busbar Integrated SiC-based Converter with Embedded Heat-pipes
Yao Chang,Amir Sajjad Bahman,Haoze Luo,Wuhua Li,Xiangning He,Francesco Iannuzzo,Frede Blaabjerg 전력전자학회 2019 ICPE(ISPE)논문집 Vol.2019 No.5
In this paper, a bus-bar integrated packaging technology for press-pack power modules is proposed. The proposed packaging technology features high power-density, even pressure distribution among chips, and low stray parameters. The structure design and fabrication flow process are analyzed and experiments are made to verify the feasibility of proposed solution. The critical challenge about the package is related to thermal management. To reduce the thermal stress of chips, a heat-pipe integrated heatsink is developed and finite-element-method (FEM) simulations are used to evaluate the cooling performance of the proposed heatsink. The results demonstrate that the proposed heatsink has a relatively low cost and works effectively. It paves the way to better packaging design and more efficient thermal management method for high power devices.
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Power electronic converter reliability and prognosis review focusing on power switch module failures
Abuelnaga, Ahmed,Narimani, Mehdi,Bahman, Amir Sajjad The Korean Institute of Power Electronics 2021 JOURNAL OF POWER ELECTRONICS Vol.21 No.6
The current trend is to go for more electric systems that rely extensively on power electronics such as EVs/HEVs and electric aircrafts, along with an increased use of renewable energy resources and variable speed motor drives. However, some field failure reports have revealed that power electronic converters represent the weakest point in these systems. A significant percentage of system failures are due to power electronic converter failures, which compromises systems reliability. This raises questions regarding the validity of relying on the current power electronic converter technology to run mission-critical/must-to-be-safe systems. Although power electronic converter technology has reached an advanced level in terms of efficiency, power density, and control, extra work should be done when it comes to reliability. Reliability engineering brings performing failure data analysis, accelerated life testing, lifetime prediction, and the implementation of efficient maintenance and reliability improvement schemes into an integrated process. This process is meant to enhance the reliability of a product throughout its life cycle. This paper provides an overview of the application of the key aspects of new approaches in reliability engineering for power electronic converters. The focus of this paper is on power switch bond-wire modules since they are the most vulnerable component in power electronic converters. This paper also proposes two general schemes for condition-based remaining useful lifetime (RUL) that are discussed in detail.
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