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착화제와 pH가 무전해 Ni-Co-P 도금 피막의 석출거동에 미치는 영향
최벽근 ( Byuck Keun Choi ),양승기 ( Seung Gi Yang ),신지웅 ( Ji Wung Shin ),황운석 ( Woon Suk Hwang ) 한국부식방식학회(구 한국부식학회) 2014 Corrosion Science and Technology Vol.13 No.3
Electroless plated Ni-Co-P films have been used to suppress the electromagnetic waves from magnetic recording media, and the suppression is known to be achieved with films made with optimized plating composition and plating condition. Effects of complexing agents on the deposition rate and bath stability of Ni-Co-P film were studied using sodium citrate, sodium tartrate and multi-complex agents containing both of them. Deposition of electroless Ni-Co-P platings was dependent upon the complexing agents. Deposition rate was twice when using sodium tartrate compared to that using sodium citrate. And it was slightly slower with multi-complex agents than with sodium tartrate, bath stability being declined in the former. Deposition rate increased with increasing pH until pH 11. Excellent bath stability and good deposition rate were obtained using multi-complex agent as sodium citrate 0.10 mol/L and sodium tartrate 0.15 mol/L in the electroless Ni-Co-P plating films.