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반도체 부품 마크 미세 결함 검사를 위한 패턴 영역 분할 및 인식 방법
장유정(Yuting Zhang),이정섭(Jung-Seob Lee),주효남(Hyonam Joo),김준식(Joon-seek Kim) 제어로봇시스템학회 2010 제어·로봇·시스템학회 논문지 Vol.16 No.9
To inspect the defects of printed markings on the surface of IC package, the OCV (Optical Character Verification) method based on NCC (Normalized Correlation Coefficient) pattern matching is widely used. In order to detect the micro pattern defects appearing on the small portion of the markings, a Partitioned NCC pattern matching method was proposed to overcome the limitation of the NCC pattern matching. In this method, the reference pattern is first partitioned into several blocks and the NCC values are computed and are combined in these small partitioned blocks, rather than just using the NCC value for the whole reference pattern. In this paper, we proposed a method to decide the proper number of partition blocks and a method to inspect and combine the NCC values of each partitioned block to identify the defective markings.