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평판형 히트파이프식 핫척의 표면온도 균일화 향상을 위한 연구
김대현(D. H. Kim),이석호(S. H. Rhi),임택규(T. K. Lim),이충구(C. G. Lee) 대한기계학회 2008 대한기계학회 춘추학술대회 Vol.2008 No.11
In the precision hot plate for wafer processing, the temperature uniformity of upper plate surface is one of the key factors affecting the quality of wafers. Precision hot plates require temperature variations less than ±1.5% during heating to 120℃. In this study, we have manufactured the flat plate heat pipe hot chuck of circle type(300㎜) and investigated the operating characteristics of flat plate heat pipe hot chuck experimentally. Various liquids(aceton, FC-40, water) were used as the working fluid and charging ratio was changed(14~36 vol.%). Several cases were tested to improve temperature uniformity. Major working fluid to be investigated was water. Using water, various parameters such as charging ratio, wafer operation on-off time, different working fluids. In case of water, the temperature unformity was ±1.5%, response time of wafer were investigated.