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신태호(Tae-Ho Shin),지병관(Byeong-Gwan Ji),김명수(Myoung-Soo Kim),이다혁(Da-Hyeok Lee),김한빛(Han-Bit Kim),박상종(Sang-Jong Park),이창원(Chang-Won Lee),이승걸(Seung-Gol Lee),박세근(Se-Geun Park),오범환(Beom-Hoan O) 대한전자공학회 2016 대한전자공학회 학술대회 Vol.2016 No.6
In this paper, a chamber has been developed to strip photoresists on large-area wafers. It is calculated by different RF-power and inlet flow rate of oxygen. And distribution of each species and velocity magnitude, which is 1mm above wafer surface, are investigated. The software that used is CFD-ACE+. The ashing rate is improved as RF-power and flow rate are increased. However the uniformity is decreased when those are increased.