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Sn-3.0Ag-0.5Cu 솔더재료의 크립-피로 균열진전에 대한 연구
우태욱(Tae Wuk Woo),Masao Sakane,Kaoru Kobayashi,박현철(Hyun Chul Park) 대한기계학회 2009 대한기계학회 춘추학술대회 Vol.2009 No.11
This study investigates crack growth behavior of Sn-3.0Ag-0.5Cu lead-free solder under creep-fatigue conditions. Crack growth tests were conducted using center-cracked-plate specimens in slow-fast (cp), fastslow (pc) and slow-slow (cc) strain waveforms with nominal strain control. The crack growth rates for the three strain waveforms were correlated with the creep J-integral range.
Sn-3.0Ag-0.5Cu 솔더재료의 피로 균열진전에 관한 연구
우태욱(Tae Wuk Woo),김광수(Kwang Soo Kim),Masao Sakane,Kaoru Kobayashi 대한기계학회 2008 대한기계학회 춘추학술대회 Vol.2008 No.11
This study investigates crack propagation behavior of Sn-3.0Ag-0.5Cu solder under pull-push loading conditions. Fatigue Crack Growth (FCG) tests were conducted on Center Cracked Plate (CCP) specimens in fast-fast (pp) strain waveform. The fast-slow (pc), slow-fast (cp) and slow-slow (cc) strain waveforms were also used to study the effect of strain rates. The crack propagation rates for the four strain waveforms were correlated with J-integral range and a scatter band of factor 4 was found. The crack growth rates for the pc waveform was highest, followed by cp, cc and then pp waveforms.