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QFN 패키지의 Resin Bleed와 Melting 검출 알고리즘
왕명걸(Mingjie Wang),박덕천(Duckchun Park),주효남(Hyonam Joo),김준식(Joon-Seek Kim) 제어로봇시스템학회 2009 제어·로봇·시스템학회 논문지 Vol.15 No.9
There are many different types of surface defects on semiconductor Integrated Chips (IC’s) caused by various factors during manufacturing process, such as Scratch, Flash, Resin bleed, and Melting. These defects must be detected and classified by an inspection system for productivity improvement and effective process control. Among defects, in particular, Resin bleed and Melting are the most difficult ones to classify accurately. The brightness value and the shape of Resin bleed and Melting defects are so similar that normally it is difficult to classify the Resin bleed and Melting. In this paper, we propose a segmenting method and a set of features for detecting and classifying the Resin bleed and Melting defects.