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윤형석(Hyung Seok Yoon),최광성(Kwang Seong Choi),배현철(Hyun Cheol Bae),임병옥(Byeong Ok Lim),엄용성(Yong Sung Um),문종태(Jong Tae Moon),전인수(In Su Jeon) 대한기계학회 2010 대한기계학회 춘추학술대회 Vol.2010 No.5
솔더 접합부의 신뢰성은 패키지의 수명에 가장 큰 비중을 차지하며, 그 중에 가장 큰 영향을 끼치는 인자는 이종재료간의 열팽창계수의 불일치이다. 플립칩 패키지의 신뢰성에 영향을 주는 인자들에 대해 알아보고, parametric study에 의거한 유한요소 해석을 수행하였다. 칩과 펌프의 두께, interposer의 두께, underfill 의 충진 형태, 그리고 underfill의 물성 등 여러 인자들 중에 패키지에 충진 되는 underfill의 CTE가 응력 감소에 가장 큰 영향을 끼치는 것을 알 수 있었다. 그리고 이에 따른 설계 최적화를 이룰 수 있었다. The reliability of the solder interconnection occupies the big effect at the lifetime of a package. And the factor among them having the big effect is the mismatch of the coefficient of thermal expansion between different kind material. Affect the reliability of flip chip package, learn about factors, parametric study based on finite element analysis was performed. It is seen that CTE of the underfill filled in a package among many factors including the thickness of a chip and bump, thickness of an interposer, filling form of an underfill and properties of matter of an underfill, and etc. influences the big effect on the stress relief. And it could be comprised the design optimization according to this.
3D stack package의 구조해석과 모아레 측정법을 이용한 결과 비교
윤형석(Hyung Seok Yoon),최광성(Kwang Seong Choi),배현철(Hyun Cheol Bae),임병옥(Byeong Ok Lim),엄용성(Yong Sung Um),문종태(Jong Tae Moon),전인수(In Su Jeon) 대한기계학회 2010 대한기계학회 춘추학술대회 Vol.2010 No.11
Semiconductor devices become smaller, higher density and performance required is increased interest in this issue is a 3D package technology; Thermo-mechanical reliability was interested in. Coefficient of thermal expansion mismatch between dissimilar materials of the package takes the biggest factors in life are most interested in TSV (through silicon via) and the solder joints were treated with the finite element method. Bump chip thickness, interposer thickness, underfill's material property package of several factors that affect the reliability of CTE of underfill for the study was conducted by the largest change in stress was found to appear. We were aiming to optimize the design, production and real samples by comparing the results of the Moire measuring the reliability of numerical results have been verified.