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고장물리에 기반한 고온용 온도센서 솔더접합부의 수명향상연구
박승일(SeungIl Park),제이콥스 솜닉(Jacobs Somnic),한창운(Changwoon Han),이현석(Hyeonseok Lee),안영기(YoungGi An),정재성(Jae Seong Jeong),류해용(Haeyoung Ryu),사윤기(Yoonki Sa) 대한기계학회 2018 대한기계학회 춘추학술대회 Vol.2018 No.12
Photo lithography is an important step in semiconductor process. This process affects the quality of the semiconductor. In recent report, the failures of solder joint is observed in a short span of time at the equipment carrying out the photo lithography process. One of the failures is fracture due to the condition of solder joints in high temperatures (~230°C). Result of analysis based on Physics-of-Failure confirmed that at high temperatures, excessive stress is generated in the solder joint due to viscoplasticity. For this situation, the failure mechanism of solder joints is assumed to be creep. In this paper, we suggest which solder better for the temperature sensor solder joint at high temperature based on Physics-of-Failure. In addition, we perform the life prediction for 97.5Pb2.5Sn solder. As a result, sintered nano-scale silver paste has longer lifetime than 97.5Pb2.5Sn due to lower stress values at high temperature conditions.