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- 저자 : 신지웅 ( Ji Wung Shin ) (검색결과 2 건)
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Ni-Mn 전착층의 기계적 성질에 미치는 공정조건의 영향
신지웅 ( Ji Wung Shin ),양승기 ( Seung Gi Yang ),황운석 ( Woon Suk Hwang ) 한국부식방식학회 2014 Corrosion Science and Technology Vol.13 No.3
Nickel electrodeposition from sulfamate bath has several benefits such as low internal stress, high current density and good ductility. In nickel deposited layers, sulfur induces high temperature embrittlement, as Ni-S compound has a low melting temperature. To overcome high temperature embrittlement problem, adding manganese is one of the good methods. Manganese makes Mn-S compound having a high melting temperature above 1500℃. In this work, the mechanical properties of Ni-Mn deposited layers were investigated by using various process variables such as concentration of Mn(NH2SO3)2, current density, and bath temperature. As the Mn content of electrodeposited layers was increased, internal stress and hardness were increased. By increasing current density, internal stress increased, but hardness decreased. With increasing the bath temperature from 55 to 70℃, internal stress of Ni deposit layers decreased, but hardness didn``t change by bath temperature. It was likely that eutectoid manganese led to lattice deformation, and the lattice deformation increased hardness and internal stress in Ni-Mn layers. Increasing current density and decreasing bath temperature would increase a mount of H2 absorption, which was a cause for the rise of internal stress.
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착화제와 pH가 무전해 Ni-Co-P 도금 피막의 석출거동에 미치는 영향
최벽근 ( Byuck Keun Choi ),양승기 ( Seung Gi Yang ),신지웅 ( Ji Wung Shin ),황운석 ( Woon Suk Hwang ) 한국부식방식학회 2014 Corrosion Science and Technology Vol.13 No.3
Electroless plated Ni-Co-P films have been used to suppress the electromagnetic waves from magnetic recording media, and the suppression is known to be achieved with films made with optimized plating composition and plating condition. Effects of complexing agents on the deposition rate and bath stability of Ni-Co-P film were studied using sodium citrate, sodium tartrate and multi-complex agents containing both of them. Deposition of electroless Ni-Co-P platings was dependent upon the complexing agents. Deposition rate was twice when using sodium tartrate compared to that using sodium citrate. And it was slightly slower with multi-complex agents than with sodium tartrate, bath stability being declined in the former. Deposition rate increased with increasing pH until pH 11. Excellent bath stability and good deposition rate were obtained using multi-complex agent as sodium citrate 0.10 mol/L and sodium tartrate 0.15 mol/L in the electroless Ni-Co-P plating films.
ScienceON
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