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이상현(S. H. Lee),곽호상(H. S. Kwak),한창수(C. S. Han),류도현(D. H. Ryu) 한국전산유체공학회 2003 한국전산유체공학회지 Vol.8 No.4
This study presents a numerical model to analyze dynamic thennal behavior of a hot chuck designed for flip-chip bonders. The hot chuck of concern is a heater which has been specifically developed for accomplishing high-speed and ultra-precision soldering. The characteristic features are radiative heat source and the heating tool made of a material of high thermal diffusivity. A physical modeling has been conducted for the network of heat transport. A simplified finite volume model is deviced to simulate time-dependent thermal behavior of the heating too on which soldering is achieved. The reliability of the proposed numerical model is verified experimentally. A series of numerical tests illustrate the usefulness of the numerical model in design analysis.