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Thermal properties of nano fumed silica added epoxy adhesives for micro-assembly
이동현(Donghyun Lee),임지윤(Jiyun Lim),남승웅(Seungwoong Nam),김대흠(Daeheum Kim) 한국생산제조학회 2007 한국공작기계학회 춘계학술대회논문집 Vol.2007 No.-
For synthesis of adhesive material for micro-assemblys, epoxy adhesives that especially compounded with epoxy resins(YD-128, YDPN-638), hardner(Hexahydro-4-methylphthalic anhydride), catalyst(2-ethyl-4-methylimidazole) and filler(nano fumed silica) with ratios of Tg's of epoxy adhesives that cured at 120℃, for 2 hours were analyzed by DSC(Differential Scanning Calorimetry) and TGA(Thermogravimetrical Analyzer). Thermal property increases of epoxy adhesives were confirmed with increasing nano fumed silica contents.
Thermal properties of nano fumed silica added epoxy adhesives for micro-assembly
이동현(Donghyun Lee),임지윤(Jiyun Lim),남승웅(Seungwoong Nam),김대흠(Daeheum Kim) 한국생산제조학회 2007 한국생산제조시스템학회 학술발표대회 논문집 Vol.2007 No.5
For synthesis of adhesive material for micro-assemblys, epoxy adhesives that especially compounded with epoxy resins(YD-128, YDPN-638), hardner(Hexahydro-4-methylphthalic anhydride), catalyst(2-ethyl-4-methylimidazole) and filler(nano fumed silica) with ratios of Tg's of epoxy adhesives that cured at 120℃, for 2 hours were analyzed by DSC(Differential Scanning Calorimetry) and TGA(Thermogravimetrical Analyzer). Thermal property increases of epoxy adhesives were confirmed with increasing nano fumed silica contents.