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Cu/Sn Rim 본딩을 이용한 MEMS 패키지의 Cap 형성공정
김성규,오태성,문종태,Kim, S.K.,Oh, T.S.,Moon, J.T. 한국마이크로전자및패키징학회 2008 마이크로전자 및 패키징학회지 Vol.15 No.4
캐비티 형성이 불필요한 MEMS 캡 본딩을 위해 전기도금법을 이용하여 Cu/Sn rim 구조를 형성하였으며, $25{\sim}400{\mu}m$ 범위의 rim 폭에 따른 본딩특성을 분석하였다. Cu/Sn rim의 폭이 증가함에 따라 rim 패키지 내부의 유효 실장면적비가 감소하는 반면에 파괴하중비가 증가하며, Cu/Sn rim 폭이 150 ${\mu}m$일 때 유효 실장면적비와 파괴하중비를 최적화할 수 있을 것으로 예측되었다. 폭 25 ${\mu}m$ 및 폭 50 ${\mu}m$인 Cu/Sn rim 접합부에서는 모든 계면에서 본딩이 이루어진 반면에, 100 ${\mu}m$ 이상의 폭을 갖는 rim 접합부에서는 Sn 도금표면의 거칠기에 의해 본딩이 이루어지지 않은 기공 부위가 관찰되었다. To develop the MEMS cap bonding process without cavity formation, we electroplated Cu/Sn rim structures and measured the bonding characteristics for the Cu/Sn rims of $25{\sim}400{\mu}m$ width. As the effective device-mounting area ratio decreased and the failure strength ratio increased for wider Cu/Sn rim, these two properties were estimated to be optimized for the Cu/Sn rim with 150 ${\mu}m$ width. Complete bonding was accomplished at the whole interfaces of the Cu/Sn packages with the rim widths of 25 ${\mu}m$ and 50 ${\mu}m$. However, voids were observed locally at the interfaces with the rim widths larger than 100 ${\mu}m$. Such voids were formed by local non-contact between the upper and lower rims due to the surface roughness of the electroplated Sn.
전기도금법을 이용하여 형성한 Au-Sn 플립칩 접속부의 미세구조 및 접속저항
김성규,오태성,Kim, S.K.,Oh, T.S. 한국마이크로전자및패키징학회 2008 마이크로전자 및 패키징학회지 Vol.15 No.4
Au와 Sn을 순차적으로 도금한 Au/Sn 범프를 플립칩 본딩하여 Au-Sn 솔더 접속부를 형성 후, 미세구조와 접속저항을 분석하였다. $285^{\circ}C$에서 30초간 플립칩 본딩한 Au-Sn 솔더 접속부는 $Au_5Sn$+AuSn lamellar 구조로 이루어져 있으며, 이 시편을 $310^{\circ}C$에서 3분간 유지하여 2차 리플로우시 $Au_5Sn$+AuSn interlamellar spacing이 증가하였다. $285^{\circ}C$에서 30초간 플립칩 본딩한 Au-Sn 접속부는 15.6 $m{\Omega}$/bump의 평균 접속저항을 나타내었으며, 이 시편을 다시 $310^{\circ}C$에서 3분간 유지하여 2차 리플로우 한 Au-Sn 접속부는 15.0 $m{\Omega}$/bump의 평균 접속저항을 나타내었다. Microstructure and contact resistance of the Au-Sn solder joints were characterized after flip-chip bonding of the Au/Sn bumps processed by successive electrodeposition of Au and Sn. Microstructure of the Au-Sn solder joints, formed by flip-chip bonding at $285^{\circ}C$ for 30 sec, was composed of the $Au_5Sn$+AuSn lamellar structure. The interlamellar spacing of the $Au_5Sn$+AuSn structure increased by reflowing at $310^{\circ}C$ for 3 min after flip-chip bonding. While the Au-Sn solder joints formed by flip-chip bonding at $285^{\circ}C$ for 30 sec exhibited an average contact resistance of 15.6 $m{\Omega}$/bump, the Au-Sn solder joints reflowed at $310^{\circ}C$ for 3 min after flip-chip bonding possessed an average contact resistance of 15.0 $m{\Omega}$/bump.
비정질 연자성재료를 이용한 복층 차폐체의 저주파 자기장 차폐효과
김성규(S. G. Kim),허진(J. Hur),박포규(P. G. Park),정연춘(Y. C. Chung),김윤배(Y. B. Kim),김택기(T. K. Kim) 한국자기학회 1998 韓國磁氣學會誌 Vol.8 No.6
Magnetic shielding effect of cylinderical shields made of commercial amorphous ribbons has been studied. The shell-arragement-order of double shell shield has been found to show a striking difference in shielding factor. In low applied field region, a 2605CO-2705M-shield (outer shell: 2605CO, inner shell: 2705M) yields two times higher shielding factor than a 2705M-2605CO-shield (outer shell: 2705M, inner shell: 2605CO). The reasons are as follows: In case of 2605CO-2705M-shield, the outer shell is not easily saturated and effectively shields the applied field. In addition, the inner shell shows high shielding factor in the field shielded by the outer shell. In case of 2705M-2605CO-shield, the outer shell is saturated at very low field as well as the inner shell shows low shielding factor in the field shielded by the outer shell.
김성규(S.G.Kim),최현규(H.K.Choi) 한국해양대학교 해사산업연구소 1998 海事産業硏究所論文集 Vol.8 No.-
Marine fresh water generator is normally used to provide high quality distillate from sea water for the vessel's water systems, portable waters and drinking water. There are many types of fresh water generators as distillation, ion exchange, reverse osmosis, electrodialysis and freeze methods which may be used for the desalination of sea water. Hot cooling water or auxiliary system is often used as a heat source increasing cost effectiveness. This study is concerning to develope 1 ton/day low pressure evaporation type fresh water generator for the use of islands in the season of water shortage.