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이 학술지의 논문 검색
Silicon Microparticle Ejection Using Mist-jet Technology
Yokoyama, Y.; Murakami, T.; Tokunaga, T.; Itoh, T. JAPAN INSTITUTE OF ELECTRONICS PACKAGING 2011 p.1-5
Kayano, Y.; Mimura, K.; Inoue, H. JAPAN INSTITUTE OF ELECTRONICS PACKAGING 2011 p.6-16
Fine Pitch Wirebonds on Ultra Low-k Device
Hisada, T.; Aoki, T.; Okamoto, K.; Harada, S.; Malinowski, J.C.; Beckham, K.F.; Shaw, T.M.; Liu, X.H.; Herbst, B.W. JAPAN INSTITUTE OF ELECTRONICS PACKAGING 2011 p.17-23
Adhesion Improvement on Smooth Cu Wiring Surfaces of Printed Circuit Boards
Tani, M.; Sasaki, S.; Uenishi, K. JAPAN INSTITUTE OF ELECTRONICS PACKAGING 2011 p.24-30
Electro-Thermal Scaling Analysis of Si MOSFETs with Device Length Typically Larger than 100 nm
Fushinobu, K.; Hatakeyama, T. JAPAN INSTITUTE OF ELECTRONICS PACKAGING 2011 p.31-35
A Release Property of High-Permittivity Thin Film Manufactured with Nano-Transfer Method
Iimura, K.; Hosono, T.; Ichiki, M.; Itoh, T.; Suga, T. JAPAN INSTITUTE OF ELECTRONICS PACKAGING 2011 p.36-39
An Electrode Structure for Ferroelectric Thin Films and Its Application to the Nanotransfer Method
Hosono, T.; Iimura, K.; Ichiki, M.; Itoh, T.; Suga, T. JAPAN INSTITUTE OF ELECTRONICS PACKAGING 2011 p.40-43
Yasunaga, M.; Shimada, H.; Akita, S.; Ishiguro, M.; Yoshihara, I. JAPAN INSTITUTE OF ELECTRONICS PACKAGING 2011 p.44-51
Yuki, K.; Suzuki, K. JAPAN INSTITUTE OF ELECTRONICS PACKAGING 2011 p.52-60
Electro-Thermal Analysis and Monte Carlo Simulation for Thermal Design of Si Devices
Hatakeyama, T.; Ishizuka, M.; Nakagawa, S.; Fushinobu, K. JAPAN INSTITUTE OF ELECTRONICS PACKAGING 2011 p.61-67