Comparison of the Electrical Characteristics of Serpentine-Type and Double-Comb-Type Antennas for Large-Area Plasma Generation

다국어 초록 (Multilingual Abstract)

The characteristics of a large-size internal-type inductively
coupled plasma (ICP) source having a ``double-comb-type" antenna
have been investigated for the processing of a large-area flat-panel
display substrate having a size of 2,300 mm × 2,000 mm, and
its characteristics were compared with those for an ICP source
having a ``serpentine-type" antenna. The ICP source with the
``double-comb-type" antenna showed a lower impedance, a higher
plasma uniformity, and a higher plasma density compared to the ICP
source with the ``serpentine-type" antenna. The measured plasma
density and uniformity of the ICP source with the
``double-comb-type" antenna were higher than 8.5 ×
10 10/㎤ and lower than 14%, respectively, at a 10 kW rf
power and 15 mTorr of Ar. The etch uniformity of the photoresist
within the substrate was about 12.5% at a 8 kW rf power and 15
mTorr Ar/O₂ (7 : 3).

다국어 초록 (Multilingual Abstract)

The characteristics of a large-size internal-type inductively
coupled plasma (ICP) source having a ``double-comb-type" antenna
have been investigated for the processing of a large-area flat-panel
display substrate having a size of 2,300 mm × 2,000 mm, and
its characteristics were compared with those for an ICP source
having a ``serpentine-type" antenna. The ICP source with the
``double-comb-type" antenna showed a lower impedance, a higher
plasma uniformity, and a higher plasma density compared to the ICP
source with the ``serpentine-type" antenna. The measured plasma
density and uniformity of the ICP source with the
``double-comb-type" antenna were higher than 8.5 ×
10 10/㎤ and lower than 14%, respectively, at a 10 kW rf
power and 15 mTorr of Ar. The etch uniformity of the photoresist
within the substrate was about 12.5% at a 8 kW rf power and 15
mTorr Ar/O₂ (7 : 3).

참고문헌 (Reference)

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