Effects of Electroplating Current Density and Duty Cycle on Nanocrystal Size and Film Hardness

다국어 초록 (Multilingual Abstract)

Pulse electroplating was studied to form nanocrystal structure effectively by changing plating current density and duty cycle. When both of plating current density and duty cycle are decreased from 100mA/㎠ and 70% to 50mA/㎠ and 30%, the P content in the Ni matrix was increased almost up to the composition of Ni3P compound and the grain growth after annealing was retarded as well. The as-plated hardness values ranging from 660 to 753 HV are mainly based on the formation of nanocrystal structure. On the other hand, the post-anneal hardness values ranging from 898 to 1045 HV, which are comparable to the hardness of hard Cr, are coming from how competition worked between the precipitation of Ni3P and the grain coarsening. According to the ANOVA and regression analysis, the plating current density showed more strong effect on nanocrystal size and film hardness than the duty cycle.

참고문헌 (Reference)

1 Mote1, V.D., "Williamson-Hall Analysis in Estimation of Lattice Strain in Nanometer-Sized ZnO Particles" 6 : 6-, 2015

2 McMahon, G, "Structural Transitions in Electroplated Ni-P alloys" 8 : 865-868, 1989

3 Lee, K.H, "Statistics Using EXCEL" JaYu Academy 2000

4 Ibl, N., "Some Theoretical Aspects of Pulse Electrolysis" 10 (10): 81-104, 1980

5 Chandrasekar, M.S, "Pulse and Pulse Reverse Plating-Conceptual, Advantages and Applications" 53 : 3313-3322, 2008

6 Koch, C.C, "Nanostructured Materials: Processing, Properties, and Applications" William Andrew Inc. 2007

7 Erb, U., "Nanostructured Materials: Processing, Properties, and Applications" William Andrew Inc. 235-292, 2007

8 선용빈, "Nano Crystalline Change by Heat Treatment" 한국반도체디스플레이기술학회 12 (12): 55-59, 2013

9 Wang, N., "Isokinetic Analysis of Nanocrystalline Nickel Electrodeposits upon Annealing" 45 (45): 1655-1669, 1997

10 Lu, K, "Grain Growth Kinetics and Interfacial Energies in Nanocrystalline Ni-P Alloys" 69 (69): 7345-7347, 1991