Conventional integrated circuit fabrication processes are multi-step, involve high sintering temperature, toxic waste, and are therefore expensive. Therefore, employment of cost-effective drop on demand inkjet printing process is expected to give new ...
Conventional integrated circuit fabrication processes are multi-step, involve high sintering temperature, toxic waste, and are therefore expensive. Therefore, employment of cost-effective drop on demand inkjet printing process is expected to give new opportunities in flexible electronics and other applications. However, the typical resolution of inkjet printing (=50~100㎛), which is mainly governed by the nozzle diameter, is an issue. In this work, sintering characteristics and ablation of Ag nanoparticles using frequency doubled Nd:YAG nanosecond laser were studied to apply for trimming electrical micro-conductor printed by inkjet. Ag nano particles dissolved in ethylene glycol was used and polyvinylpyrrolidone was added to prevent agglomeration. Here, nanoparticles are used to exploit the melting temperature depression compared to bulk material, so that printed metal nanoparticle film could be sintered at a reduced temperature compatible to polymer.