In this paper, Scanning Programs are implemented for SAM which conduct nondestructive testing inspection of integrated circuits packages and locate internal discontinuities. The implemented programs provide A, B, C-Scan and 3D display functions and a ...
In this paper, Scanning Programs are implemented for SAM which conduct nondestructive testing inspection of integrated circuits packages and locate internal discontinuities. The implemented programs provide A, B, C-Scan and 3D display functions and a Multi-Layer Scan function scanning up to 20 layers. Various functions such as C-scan by amplitude, TOF, or phase inversion information, clustering function and etc. make it easy to detect the fatal defects such as delamination, crack, and void.