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Topical Special Issue on the Electrical Performance of Packages and Interconnects
Schutt-Aine, J. E. IEEE 2007 p.162
Design and Characterization of the EBG Waveguide-Based Interconnects
Suntives, A.; Abhari, R. IEEE 2007 p.163-170
Shahparnia, S.; Ramahi, O. M. IEEE 2007 p.171-179
Choi, J.; Kam, D. G.; Chung, D.; Srinivasan, K.; Govind, V.; Kim, J.; Swaminathan, M. IEEE 2007 p.180-190
Fully Integrated AC Coupled Interconnect Using Buried Bumps
Wilson, J.; Mick, S.; Xu, J.; Luo, L.; Bonafede, S.; Huffman, A.; LaBennett, R.; Franzon, P. D. IEEE 2007 p.191-199
A 3-D Miniaturization Method for Low-Impedance Designs
Banerjee, S. R.; Zheng, C.; Drayton, R. F. IEEE 2007 p.200-208
Computer Code for Passivity Enforcement of Rational Macromodels by Residue Perturbation
Gustavsen, B. IEEE 2007 p.209-215
Deschrijver, D.; Haegeman, B.; Dhaene, T. IEEE 2007 p.216-225
Grivet-Talocia, S. IEEE 2007 p.226-237
Parametric Macromodels of Differential Drivers With Pre-Emphasis
Stievano, I. S.; Maio, I. A.; Canavero, F. G.; Siviero, C. IEEE 2007 p.238-245