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Review of Lead Free Control Plan Requirements
Woody, L. Red Hook, N.Y.; Curran Associates 2012 p.546-565
Xie, W.; Lee, T.-K.; Perng, S. Red Hook, N.Y.; Curran Associates 2012 p.566-574
SnAgCu Lead-Free Electronics Reliability Under Combined Temperature and Vibration Environments
Lall, P.; Limaye, G. Red Hook, N.Y.; Curran Associates 2012 p.575-583
Solder Alloy Creep Constants for Use in Thermal Stress Analysis
Darveaux, R.; Reichman, C. Red Hook, N.Y.; Curran Associates 2012 p.584-593
Rafanelli, A. Red Hook, N.Y.; Curran Associates 2012 p.594-598
SnZn Solder Alternative for Low Cost Pb-free Surface Mount Assemblies
Jackson, G.; Wilding, I.J.; Boyle, R.; Liu, P.; Holloway, M.; Collins, M.N.; Dalton, E.; Punch, J. Red Hook, N.Y.; Curran Associates 2012 p.605-612
Ag-Au-Ge Alloys for High Temperature Geothermal and Oil Well Electronics Applications
Vianco, P.T.; Grant, R.; Rejent, J.A.; Crenshaw, T.B.; Kilgo, A.C. Red Hook, N.Y.; Curran Associates 2012 p.613-624
Case Study: Development of a Low Temperature Tin-Bismuth-Silver Solder Paste
Guene, E.; Puechagut, C. Red Hook, N.Y.; Curran Associates 2012 p.625-632
Types of Conformal Coatings, Applications and Process Issue Mitigation
Allen, D. Red Hook, N.Y.; Curran Associates 2012 p.633-638