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Abrasive Particle Effect on the Planarization of Cu Film
Chang, S.; Butch, I.; Banerjee, G.; Tamboli, D.; Waddel, M.; Hymes, S. Pennington, NJ:; Electrochemical Society, 2003 p.1-9
Post-CMP Challenges for Cu-Low K Integration
Tamboli, D.; Banerjee, G.; Waddell, M.; Listebarger, J.; Arefeen, Q.; Hymes, S. Pennington, NJ:; Electrochemical Society, 2003 p.10-18
Effect of Additives in Post Cu CMP Cleaning Solutions on Particle Adhesion and Removal
Hong, Y. K.; Eom, D. H.; Lee, S. H.; Park, J. G.; Busnaina, A. A. Pennington, NJ:; Electrochemical Society, 2003 p.19-26
The Role of Chemical Components in Copper CMP Slurries
Luo, Y.; Du, T.; Desai, V. Pennington, NJ:; Electrochemical Society, 2003 p.27-34
Li, Z.; Rader, S.; Lefevre, P.; Ina, K.; Philipossian, A. Pennington, NJ:; Electrochemical Society, 2003 p.35-43
Eom, D.-H.; Ryu, J.-S.; Hong, Y.-K.; Myung, J.-J.; Kim, K.-S.; Park, J.-G. Pennington, NJ:; Electrochemical Society, 2003 p.44-51
Chemical-mechanical Planarization of Copper: Role of Oxidants and Inhibitors
Kuiry, S.; Deshpande, S.; Obeng, Y.; Seal, S. Pennington, NJ:; Electrochemical Society, 2003 p.52-60
Heating and Convection in Copper Polishing
Borucki, L.; Li, Z.; Philipossian, A. Pennington, NJ:; Electrochemical Society, 2003 p.61-67
Electrochemical Aspects of Copper Chemical Mechanical Planarization (CMP) in Peroxide Based Slurry
Ein-Eli, Y.; Abelev, E.; Starosvetsky, D. Pennington, NJ:; Electrochemical Society, 2003 p.68-75
Copper Chemical Mechanical Planarization Processes in Carbon Dioxide
Denison, G.; Visintin, P.; Bessel, C.; Murray, R.; DeSimone, J. Pennington, NJ:; Electrochemical Society, 2003 p.76-82